Semiconductor package and manufacturing method thereof

A semiconductor package, comprising:

• a fingerprint sensor die;
• an encapsulant laterally encapsulating the fingerprint sensor die;
• a first redistribution structure disposed on the fingerprint sensor die and the encapsulant, wherein the first redistribution structure comprises stacked dielectric layers and redistribution wirings embedded in the stacked dielectric layers, and the redistribution wirings are electrically connected to the fingerprint sensor die;
• a protection layer covering an upper surface of the first redistribution structure;
• and
• an insulating cover adhered with an upper surface of the protection layer through an adhesive, wherein an oxygen and/or water vapor permeability of the protection layer is lower than an oxygen and/or vapor permeability of the stacked dielectric layers.

A semiconductor package, comprising:

• a fingerprint sensor die;
• an encapsulant laterally encapsulating the fingerprint sensor die;
• a coreless redistribution structure disposed on the fingerprint sensor die and the encapsulant, wherein the coreless redistribution structure comprises at least one polymer layer and redistribution wirings embedded in the at least one polymer layer, and the redistribution wirings are electrically connected to the fingerprint sensor die;
• and
• a protection layer covering an upper surface of the coreless redistribution structure, wherein an oxygen and/or water vapor permeability of the protection layer is lower than an oxygen and/or vapor permeability of the polymer layer.