Workpiece holding method and workpiece processing method

A workpiece processing method for processing a workpiece including a semiconductor wafer, the workpiece having a bowl-shaped warp, the method comprising:

• a mounting step of mounting the workpiece including the semiconductor wafer on a holding unit having a holding surface for holding the workpiece, a suction hole opening to the holding surface, and a suction passage for making selective communication between the suction hole and suction means for producing a suction force, the workpiece being mounted on the holding surface of the holding unit;
• a liquid supplying step of supplying a liquid to the workpiece held on the holding surface so that the liquid flows into a gap defined between the holding surface and the workpiece to fill the gap;
• a suction step of bringing the suction hole into communication with the suction means and activating the suction means after the liquid supplying step, to suck the liquid and the workpiece and thereby hold the workpiece through suction of the liquid and the workpiece on the holding surface, after performing the liquid supplying step;
• a processing step of processing the workpiece held on the holding surface after performing the suction step by annularly cutting the semiconductor wafer along a peripheral edge thereof using a cutting blade;
• and
• an unloading step of holding the workpiece by using a transfer mechanism after performing the processing step, and then unloading the workpiece from the holding surface by using the transfer mechanism.