Collet inspection in a semiconductor pick and place apparatus
AssigneeAsm Technology Singapore Pte Ltd
InventorsKui Kam Lam, Kai Siu Lam, Cheuk Ki Tam, Nim Tak Wong, Ka Yee Mak
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Abstract
A semiconductor pick and place apparatus comprises: a pick arm having a main body, and a conduit incorporated in the main body for permitting fluid flow through the main body via the conduit, the conduit further defining a holding orifice which is operative in use to secure a semiconductor die, the conduit being configured to convey light received from one side of the pick arm through the holding orifice and an alignment window located on the main body to an opposite side of the pick arm.
Claims19
A semiconductor pick and place apparatus, comprising:
- a pick arm comprising:
- an elongate main body having a first end and a second end opposite to the first end, and
- a conduit incorporated in the elongate main body for permitting fluid flow through the main body between the said first and second ends via the conduit, the conduit further defining:
- a holding orifice formed at the second end of the elongate main body on one side of the pick arm which is operative in use to secure a semiconductor die;
- a through-hole extending, at the second end of the elongate main body, from the holding orifice on the one side of the pick arm to an opposite side of the pick arm;
- the conduit being configured to convey light received from the one side of the pick arm through the holding orifice, and an alignment window on the main body that is formed by the through-hole on the opposite side of the pick arm, wherein the elongate main body is made of a material to shield light transmission from the one side of the pick arm to the opposite side of the pick arm other than via the holding orifice.
A semiconductor pick and place method, the method comprising:
- providing a pick arm having an elongate main body having a first end and a second end opposite to the first end, and a conduit incorporated in the elongate main body for permitting fluid flow through the main body between the said first and second ends via the conduit, the conduit further defining a holding orifice formed at the second end of the elongate main body on one side of the pick arm which is operative in use to secure a semiconductor die, the pick arm further having a through-hole extending, at the second end of the elongate main body, from the holding orifice on the one side of the pick arm to an opposite side of the pick arm;
- and
- conveying light received from the one side of the pick arm through the holding orifice, and an alignment window on the main body that is formed by the through-hole on the opposite side of the pick arm, wherein the elongate main body is made of a material to shield light transmission from the one side of the pick arm to the opposite side of the pick arm other than via the holding orifice, for determining the position of the holding orifice.
Dependencies are inferred from the claim text.