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US 11,056,376 B2Granted
Removing an organic sacrificial material from a two-dimensional material
AssigneeImec Vzw
InventorsBoon Teik Chan, Jean-Francois de Marneffe, Daniil Marinov, Han Chung Lin, Inge Asselberghs
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Abstract
In a first aspect, the present disclosure relates to a method for removing an organic sacrificial material from a 2D material, comprising: providing a target substrate having thereon the 2D material and a layer of the organic sacrificial material over the 2D material, infiltrating the organic sacrificial material with a metal or ceramic material, and removing the organic sacrificial material.
Claims16
A method for removing an organic sacrificial material from a two-dimensional material, comprising:
- providing a target substrate having the two-dimensional material thereon and a layer of the organic sacrificial material over the two-dimensional material, wherein at least a portion of the organic sacrificial material is irreversibly physically adsorbed to the two-dimensional material;
- infiltrating the organic sacrificial material with a metal or ceramic material;
- and
- removing the organic sacrificial material.
1 more element
A structure, comprising:
- a target substrate;
- a two-dimensional material on the target substrate;
- and
- a layer over the two-dimensional material, the layer comprising a metal-infiltrated or ceramic material-infiltrated organic sacrificial material, wherein at least a portion of the organic sacrificial material is irreversibly physically adsorbed to the two-dimensional material.
1 more element
Dependencies are inferred from the claim text.