Method for processing workpiece
AssigneeTokyo Electron Limited
InventorsShuhei Ogawa, Keigo Toyoda, Yoshihide Kihara
Life of this patent
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Abstract
A method according to an embodiment includes: (a) a first step of etching a workpiece held by a holding structure in a state in which a first direction and a second direction are maintained to form a first angle, by a plasma generated in a processing container; and (a) a second step of, after execution of the first step, etching the workpiece held by the holding structure in a state in which the first direction and the second direction are maintained to form a second angle, by the plasma generated in the processing container.
Claims3
A method for etching a workpiece using a plasma processing apparatus, wherein
- the plasma processing apparatus includes a holding structure which holds the workpiece, and a processing container which accommodates the holding structure,
- the holding structure is rotatable by 360 degrees in the processing container around an inclination shaft provided in the processing container,
- the inclination shaft intersects the holding structure,
- an axis of the inclination shaft is parallel to a surface of an electrode plate of an upper electrode provided on a ceiling side of the processing container and a surface of the workpiece held by the holding structure,
- in a state in which the surface of the workpiece held by the holding structure and the surface of the electrode plate are parallel to each other and face each other, a first center axis of the workpiece and a second center axis of the processing container overlap with each other and a first direction of the first center axis and a second direction of the second center axis are the same,
- the first center axis is perpendicular to the surface of the workpiece,
- the first direction is directed upward of the surface of the workpiece,
- the second center axis is perpendicular to the surface of the electrode plate,
- the second direction is directed toward the electrode plate provided on the ceiling side of the processing container from a bottom portion side of the processing container,
- the first center axis is inclined with respect to the second center axis as the holding structure rotates around the inclination shaft,
- the method comprises:
- a first step of generating a plasma in the processing container in which the workpiece is held by the holding structure, in a state in which the first direction and the second direction are maintained to form a first angle;
- and
- a second step of, after execution of the first step, generating a plasma in the processing container in which the workpiece is held by the holding structure, in a state in which the first direction and the second direction are maintained to form a second angle,
- the first angle and the second angle are −180 degrees to +180 degrees,
- an absolute value of the first angle and an absolute value of the second angle are different from each other
- the workpiece includes a laminated region and a mask provided on the laminated region,
- the laminated region includes a plurality of first layers and a plurality of second layers,
- the first layers and the second layers are alternately laminated along a lamination direction,
- the first layers and the second layers being made of different materials,
- the absolute value of the first angle is smaller than the absolute value of the second angle,
- in the first step, the laminated region is etched in the lamination direction using the mask, and, by the etching, a groove is formed in the laminated region, and
- in the second step, the first layers exposed to an inside of the groove are selectively etched.
Dependencies are inferred from the claim text.