Fault detection method in semiconductor fabrication facility
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHom-Chung Lin, Jih-Churng Twu, Chin-Yun Chen, Tai-Hsiang Lin, Yu-Chi Tsai
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHom-Chung Lin, Jih-Churng Twu, Chin-Yun Chen, Tai-Hsiang Lin, Yu-Chi Tsai
Estimating the term…
A method for fault detection in a fabrication tool is provided. The method includes processing a semiconductor wafer in a fabrication tool according to a plurality of process events of a process run. The method further includes measuring humidity in the fabrication tool in at least one of the process events. The method also includes comparing the humidity measured in one of the process events with an expected humidity associated with the process event. In addition, the method includes based on the comparison, indicating an alarm condition when a difference between the measured humidity and the expected humidity exceeds a range of acceptable values associated with the process event.
A method for fault detection in a fabrication tool, comprising:
A method for fault detection in a fabrication facility, comprising:
A fabrication facility, comprising:
Dependencies are inferred from the claim text.