Wafer heating and holding mechanism and method for rotary table, and wafer rotating and holding device

A wafer heating method for a rotary table, the method comprising:

• heating a wafer by a wafer heating and holding mechanism for the rotary table, the wafer heating and holding mechanism comprising:
• a rotary shaft, the rotary table placed on an end of the rotary shaft and the rotary table having an upper surface defining a recess with sides, the rotary table including a first plurality of pins extending from the upper surface, the first plurality of pins being configured to support the wafer at a spaced distance from the upper surface, a second plurality of pins extending from the upper surface, the second plurality of pins being configured to surround a circumference of the wafer;
• a drive motor configured to supply motive power to the rotary shaft;
• and
• a heater provided above the rotary table and below the wafer while avoiding contact with the wafer, the heater being configured to heat the wafer, the heater being spaced from the sides of the recess.