Direct bonding process
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsFrank Fournel, Frederic Mazen
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Abstract
A process for attaching a first substrate to a second substrate by direct bonding includes the successive steps of: a) providing the first and second substrates, each comprising a first surface and an opposite second surface, b) bonding the first substrate to the second substrate by direct bonding between the first surfaces of the first and second substrates, step b) being carried out under a first gaseous atmosphere having a first relative humidity level denoted by φ1, and c) applying a thermal annealing treatment to the bonded first and second substrates at a thermal annealing temperature of between 20° C. and 700° C., step c) being carried out under a second gaseous atmosphere having a second humidity level denoted by φ2, satisfying φ2≥φ1.
Claims14
A process for attaching a first substrate to a second substrate by direct bonding, the process comprising:
- a) providing the first and second substrates, each comprising a first surface and an opposite second surface;
- b) bonding the first substrate to the second substrate by direct bonding between the first surfaces of the first and second substrates, b) being carried out under a first gaseous atmosphere having a first relative humidity level denoted by φ1;
- and
- c) applying a thermal annealing treatment to the bonded first and second substrates at a thermal annealing temperature of between 20° C. and 700° C., c) being carried out under a second gaseous atmosphere having a second humidity level denoted by φ2, satisfying φ2≥φ1, wherein
- the bonded first and second substrates are kept, after b) and during execution of c), under an atmosphere having a humidity level higher than or equal to φ1 such that adhesion energy of the first surfaces of the first and second substrates is homogenized.
Dependencies are inferred from the claim text.