Microfabricated ion trap chip with in situ radio-frequency sensing
AssigneeNational Technology & Engineering Solutions of Sandia, LLC
InventorsPeter Lukas Wilhelm Maunz, Matthew G. Blain, Christopher Nordquist
Life of this patent
Estimating the term…
Abstract
A radio-frequency (RF) surface ion trap chip includes an RF electrode and an integrated capacitive voltage divider in which an intermediate voltage node is capacitively connected between the RF electrode and a ground. A sensor output trace is connected to the intermediate voltage node.
Claims14
Apparatus comprising an ion trap chip of the kind in which a radio-frequency (RF) surface ion trap including an RF electrode is disposed on a substrate having a plurality of metallization levels including a top metallization level N, N a positive integer, wherein:
- the ion trap chip further comprises a capacitive voltage divider integrated on the ion trap chip;
- the capacitive voltage divider includes a sensor plate, wherein the sensor plate is sandwiched between and parallel to at least a portion of the RF electrode and at least a portion of a ground plane electrode situated at a lower metallization level than the RF electrode and sensor plate, capacitively connected between the RF electrode and said ground plane electrode, and situated on at least a first metallization level lower than the top metallization level;
- the ion trap chip further comprises a sensor output trace connected to the sensor plate, formed at least in part in a different metallization layer than the first metallization layer, and adapted for conveying an RF voltage signal from the sensor plate to a connection to off-chip sensing circuitry;
- the sensor plate is coupled through a first capacitance to the RF electrode and through a second capacitance to the ground plane electrode;
- and
- the first capacitance is less than the second capacitance.
Apparatus comprising an ion trap chip of the kind in which a radio-frequency (RF) surface ion trap including an RF electrode is disposed on a substrate having a plurality of metallization levels including a top metallization level N, N a positive integer, wherein:
- the ion trap chip further comprises a capacitive voltage divider integrated on the ion trap chip;
- and
- the capacitive voltage divider includes an intermediate voltage node capacitively connected between the RF electrode and a ground on a metallization level lower than the top metallization level;
- and wherein the ion trap chip further comprises:
- a sensor output trace connected to the intermediate voltage node;
- a temperature-sensing metal wire affixed to, and in thermal contact with, the substrate;
- one or more capacitors that are integrated on the substrate and connected to the temperature-sensing metal wire as RF shunts from the said wire to ground;
- and
- a four-probe resistance sensor connected to the temperature-sensing metal wire for sensing its electrical resistance.
Dependencies are inferred from the claim text.