Sputtering apparatus and method of forming film
AssigneeUlvac, Inc.
InventorsShinya Nakamura, Yukihito Tashiro
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AssigneeUlvac, Inc.
InventorsShinya Nakamura, Yukihito Tashiro
Estimating the term…
A sputtering apparatus is provided with: a vacuum chamber having a target manufactured by sintering raw material powder; a magnet unit having a plurality of magnets disposed on the same surface above the target which is mounted on the vacuum chamber in a non-rotatable manner, in order to cause leakage magnetic field penetrating the target to function in uneven distribution on the sputtering surface; a rotary shaft which is disposed on the center line passing through the center of the target and is coupled to the magnet unit; and a drive motor for driving the rotary shaft to rotate, thereby rotating the magnet unit such that a function region of the leakage magnetic field on the sputtering surface revolves about an imaginary circle with the center of the target serving as the center.
A sputtering apparatus comprising:
A method of forming a film comprising:
Dependencies are inferred from the claim text.