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US 11,056,321 B2Granted
Metal contamination reduction in substrate processing systems with transformer coupled plasma
AssigneeLam Research Corporation
InventorsMaolin Long, Neema Rastgar, Alexander Miller Paterson
Life of this patent
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Abstract
A substrate processing system includes a processing chamber including a substrate support to support a substrate. A coil includes at least one terminal. An RF source configured to supply RF power to the coil. A dielectric window is arranged on one surface of the processing chamber adjacent to the coil. A contamination reducer includes a first plate that is arranged between the at least one terminal of the coil and the dielectric window.
Claims14
A substrate processing system, comprising:
- a processing chamber including a substrate support to support a substrate;
- an inner coil including a first conductor including first terminals and a second conductor including second terminals;
- an outer coil including a third conductor including third terminals and a fourth conductor including fourth terminals;
- an RF source configured to supply RF power to the inner and outer coils;
- a dielectric window arranged on one surface of the processing chamber adjacent to the inner and outer coils;
- and
- a contamination reducer including:
- a first plate arranged between (a) the dielectric window and (b) a first one of the third terminals of the third conductor and a first one of the fourth terminals of the fourth conductor;
- a second plate arranged between (a) the dielectric window and (b) the first terminals of the first conductor;
- a third plate arranged between (a) the dielectric window and (b) the second terminals of the second conductor;
- and
- a fourth plate arranged between (a) the dielectric window and (b) a second one of the third terminals of the third conductor and a second one of the fourth terminals of the fourth conductor.
9 more elements
Dependencies are inferred from the claim text.