Substrate treating apparatus, substrate support unit, and substrate treating method

An apparatus for treating a substrate, the apparatus comprising:

• a housing having a process space therein;
• a support unit configured to support the substrate in the process space;
• a process gas supply unit configured to supply a process gas into the process space;
• and
• a plasma source configured to generate plasma from the process gas,
• wherein the support unit comprises:
• a support member on which the substrate is placed;
• a heating member configured to heat the substrate supported on the support member;
• and
• a heat transfer gas supply member configured to supply a heat transfer gas to a backside of the substrate supported on the support member,
• wherein the heating member comprises a plurality of heaters,
• wherein the plurality of heaters heat different regions on the substrate placed on the support member when viewed from above,
• wherein the support member comprises a protrusion configured to partition a space between the support member and the backside of the substrate placed on the support member into a plurality of gas regions, and
• wherein at least one of heating regions on the substrate heated by the heating member is divided into a plurality of regions by the protrusion when viewed from above, and
• wherein outputs of the plurality of heaters are independently controllable.