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US 11,056,271 B2Granted
Coil pattern and formation method therefor, and chip element having same
AssigneeModa-Innochips Co., Ltd.
InventorsIn Kil Park, Seung Hun Cho, Gyeong Tae Kim, Jun Ho Jung, Sang Jun Park
Life of this patent
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Abstract
Provided is a coil pattern formed on at least one surface of a substrate and including a first plating film formed on the substrate and a second plating film formed to cover the first plating film, a method of forming the coil pattern, and a chip device provided with the coil pattern.
Claims17
A coil pattern formed on one or more surfaces of a substrate and comprising:
- a first plating film formed on the substrate and having a width gradually decreased from a lower surface thereof contacting the substrate toward an upper surface thereof;
- and
- a second plating film formed to cover the first plating film,
- wherein the first plating film is formed such that a ratio of a width of the upper surface thereof to a width of the lower surface thereof is approximately 0.2:1 to approximately 0.9:1.
1 more element
A method of forming a coil pattern comprising:
- forming a mask pattern having a predetermined shape on at least one surface of a substrate;
- forming a first plating film on the substrate between the mask patterns;
- etching the first plating film after removing the mask patterns;
- and
- forming a second plating film so as to cover the first plating film.
2 more elements
A chip device comprising:
- a body;
- at least one substrate provided in the body;
- at least one coil pattern formed on at least one surface of the substrate;
- and
- an insulating layer formed between the coil pattern and the body, wherein
- the coil pattern is formed to have a width gradually increased or decreased from an innermost portion thereof toward an outermost portion thereof,
- wherein the coil pattern comprises:
- a first plating film formed on the substrate;
- and a second plating film formed to cover the first plating film,
- wherein the first plating film is formed such that a ratio of a width of an upper surface thereof to a width of a lower surface thereof is approximately 0.2:1 to approximately 0.9:1.
7 more elements
Dependencies are inferred from the claim text.