Heated floor and ceiling panel with a corrugated layer for modular use in buildings
AssigneeInnovative Building Technologies, LLC
InventorsArlan Collins, Mark Woerman
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AssigneeInnovative Building Technologies, LLC
InventorsArlan Collins, Mark Woerman
Estimating the term…
Floor and ceiling panels and methods of constructing a floor system for a building are described. In some embodiments, a panel includes a plurality of joists, a corrugated form deck disposed above and attached to the plurality of joists, a ceiling substrate disposed below and attached to the plurality of joists, and an in-floor radiant heat member disposed between the corrugated form deck and the ceiling substrate. In some embodiments, the panel includes a plurality of joists, a corrugated form deck disposed above and attached to the plurality of joists, and a sound dampener disposed between the corrugated form deck and the plurality of joists. In some embodiments, the method includes attaching a pre-assembled panel to a frame of the building and pouring concrete onto the panel so that a radiant heat member is separated from the concrete by a corrugated form deck of the panel.
A pre-assembled floor and ceiling panel for use in a building, the panel comprising:
A panel for use in a building, the panel comprising:
A method to construct a floor system for a building, the method comprising:
Dependencies are inferred from the claim text.