Multi-layer piezoelectric substrate with heat dissipation
AssigneeSkyworks Solutions, Inc.
InventorsKeiichi Maki, Rei Goto, Gong Bin Tang, Yosuke Hamaoka
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Abstract
Aspects of this disclosure relate to a filter that includes an acoustic wave device with a multi-layer substrate with heat dissipation. The multi-layer substrate includes a support substrate (e.g., a quartz substrate), a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the acoustic wave device. The thermally conductive layer is disposed between the support substrate and the piezoelectric layer. The thermally conductive layer has a thickness that is greater than 10 nanometers and less than a thickness of the piezoelectric layer.
Claims20
A filter with a multi-layer substrate with heat dissipation, the filter comprising an acoustic wave device that includes:
- a support substrate;
- a piezoelectric layer;
- an interdigital transducer electrode on the piezoelectric layer;
- and
- a thermally conductive layer configured to dissipate heat associated with the acoustic wave device, the thermally conductive layer having a higher thermal conductivity than the support substrate, the thermally conductive layer being disposed between the support substrate and the piezoelectric layer, and the thermally conductive layer having a thickness that is greater than 10 nanometers, the acoustic wave device is configured to generate an acoustic wave having a wavelength of λ, and the thickness of the thermally conductive layer being less than 0.03λ;
- the filter being arranged as a band pass filter configured to receive and filter a radio frequency signal having a frequency in a range from 450 megahertz to 6 gigahertz.
A surface acoustic wave device with a temperature compensated multi-layer substrate with heat dissipation, the surface acoustic wave device comprising:
- a support substrate;
- a piezoelectric layer;
- an interdigital transducer electrode on the piezoelectric layer;
- a thermally conductive layer configured to dissipate heat associated with the surface acoustic wave device, the thermally conductive layer having a higher thermal conductivity than the support substrate, the thermally conductive layer being disposed between the support substrate and the piezoelectric layer, and the thermally conductive layer having a thickness that is greater than 10 nanometers and less than 120 nanometers;
- and
- a temperature compensating layer having a positive temperature coefficient of frequency, the temperature compensating layer and the interdigital transducer electrode being disposed on opposite sides of the piezoelectric layer, the surface acoustic wave device being configured to generate a surface acoustic wave having a wavelength of λ.
A radio frequency module comprising:
- a radio frequency switch configured to pass a radio frequency signal having a frequency in a range from 450 megahertz to 6 gigahertz;
- a filter with a multi-layer substrate with heat dissipation, the filter including an acoustic wave device that includes a support substrate, a piezoelectric layer;
- an interdigital transducer electrode on the piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the acoustic wave device, the thermally conductive layer having a higher thermal conductivity than the support substrate, the thermally conductive layer being disposed between the support substrate and the piezoelectric layer, and the thermally conductive layer having a thickness that is greater than 10 nanometers, the acoustic wave device is configured to generate an acoustic wave having a wavelength of λ, the thickness of the thermally conductive layer being less than 0.03λ, and the filter being arranged as a band pass filter configured to receive and filter the radio frequency signal;
- and
- a package enclosing the filter and the radio frequency switch.
Dependencies are inferred from the claim text.