Methods and systems for printed circuit board design based on automatic corrections
AssigneeSVXR, Inc.
InventorsDavid Lewis Adler, Freddie Erich Babian, Scott Joseph Jewler
Life of this patent
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Abstract
In one embodiment, a computing system may access design data of a printed circuit board to be produced by a first manufacturing process. The system may analyze the design data of the printed circuit board using a machine-learning model, wherein the machine-learning model is trained based on X-ray inspection data associated with the first manufacturing process. The system may automatically determine one or more corrections for the design data of the printed circuit board based on the analysis result by the machine-learning model.
Claims20
A method comprising, by a computing system:
- accessing design data of a printed circuit board to be produced by a first manufacturing process;
- analyzing the design data of the printed circuit board using a machine-learning model, wherein the machine-learning model is trained based on X-ray inspection data associated with the first manufacturing process;
- and
- automatically determining one or more corrections for the design data of the printed circuit board based on the analysis result by the machine-learning model, wherein the one or more corrections adjust one or more parameters associated with the printed circuit board, and wherein the one or more parameters comprise one or more of:
- a width of a metal arm or conductive trace,
- a length of a metal arm or conductive trace,
- a local thickness of conductive trace,
- a distance between conductive traces,
- a roughness of a conductive trace surface,
- a sheet layer thickness,
- a distance or spacing between layers,
- a corner radius of a conductive trace path,
- a location of a plated-through via, or
- a dimension associated with a plated-through via.
One or more computer-readable non-transitory storage media embodying software that is operable when executed to:
- access design data of a printed circuit board to be produced by a first manufacturing process;
- analyze the design data of the printed circuit board using a machine-learning model, wherein the machine-learning model is trained based on X-ray inspection data associated with the first manufacturing process;
- and
- automatically determine one or more corrections for the design data of the printed circuit board based on the analysis result by the machine-learning model, wherein the one or more corrections adjust one or more parameters associated with the printed circuit board, and wherein the one or more parameters comprise one or more of:
- a width of a metal arm or conductive trace,
- a length of a metal arm or conductive trace,
- a local thickness of conductive trace,
- a distance between conductive traces,
- a roughness of a conductive trace surface,
- a sheet layer thickness,
- a distance or spacing between layers,
- a corner radius of a conductive trace path,
- a location of a plated-through via, or
- a dimension associated with a plated-through via.
A system comprising one or more processors;
- and one or more computer-readable non-transitory storage media coupled to one or more of the processors and comprising instructions operable when executed by one or more of the processors to cause the system to:
- access design data of a printed circuit board to be produced by a first manufacturing process;
- analyze the design data of the printed circuit board using a machine-learning model, wherein the machine-learning model is trained based on X-ray inspection data associated with the first manufacturing process;
- and
- automatically determine one or more corrections for the design data of the printed circuit board based on the analysis result by the machine-learning model, wherein the one or more corrections adjust one or more parameters associated with the printed circuit board, and wherein the one or more parameters comprise one or more of:
- a width of a metal arm or conductive trace,
- a length of a metal arm or conductive trace,
- a local thickness of conductive trace,
- a distance between conductive traces,
- a roughness of a conductive trace surface,
- a sheet layer thickness,
- a distance or spacing between layers,
- a corner radius of a conductive trace path,
- a location of a plated-through via, or
- a dimension associated with a plated-through via.
Dependencies are inferred from the claim text.