Switch and method of manufacturing switch

A method of manufacturing a switch that includes

• a housing,
• a switching mechanism that is housed in the housing and configured to switch a state of connection between at least two terminals exposed out of the housing by using a common contact and two switching contacts, and
• an electronic component that is disposed in the housing, and electrically connects the at least two terminals to each other,
• the switching mechanism including
• a first metal plate that is connected to a first contact, which is one of the common contact and the two switching contacts, and includes a first exposed part, and
• a second metal plate that is connected to a second contact, which is another one of the common contact and the two switching contacts, and includes a second exposed part;
• the first exposed part including a first electrode mounting part, a first soldering part, and a first peripheral part disposed along an edge of the first soldering part;
• the second exposed part including a second electrode mounting part, a second soldering part, and a second peripheral part disposed along an edge of the second soldering part;
• and
• each of the first peripheral part and the second peripheral part having a U-shape, the method comprising:
• applying solder to the first soldering part, placing a first electrode of the electronic component on the first electrode mounting part, and soldering the first electrode of the electronic component by laser irradiation to the first exposed part;
• and
• applying solder to the second soldering part, placing a second electrode of the electronic component on the second electrode mounting part, and soldering the second electrode of the electronic component by laser irradiation to the second exposed part.

A switch, comprising:

• a housing;
• a switching mechanism that is housed, in the housing and configured to switch a state of connection between at least two terminals exposed out of the housing by using a common contact and two switching contacts;
• and
• an electronic component that is disposed in the housing and electrically connects the at least two terminals to each other, wherein
• the switching mechanism includes
• a first metal plate that is connected to a first contact, which is one of the common contact and the two switching contacts, and includes a first exposed part to which a first electrode of the electronic component is soldered by laser irradiation, and
• a second metal plate that is connected to a second contact, which is another one of the common contact and the two switching contacts, and includes a second exposed part to which a second electrode of the electronic component is soldered by laser, irradiation;
• the first exposed part includes a first electrode mounting part on which the first electrode is placed;
• the second exposed part includes a second electrode mounting part on which the second electrode is placed;
• the first exposed part further includes a first protruding part that protrudes from the first electrode mounting part in a direction away from the second electrode mounting part;
• the second exposed part further includes a second protruding part that protrudes, from the second electrode mounting part in a direction away from the first electrode mounting part;
• the first metal plate further includes a first connecting part that connects the first exposed part to a remaining part of the first metal plate, the first connecting part being disposed closer to the second exposed part than the first protruding part;
• and
• the second metal plate further includes a second connecting part that connects the second exposed part to a remaining part of the second metal plate, the second connecting part being disposed closer to the first exposed part than the second protruding part.