Photonic communication platform

A computing system comprising:

• a photonic substrate patterned with a plurality of photonic modules such that the plurality of photonic modules are embedded in the photonic substrate, the plurality of photonic modules including at least first and second photonic modules, each of the first and second photonic modules being patterned according to at least one common photomask such that the first and second photonic modules share at least one common layer pattern, wherein the first photonic module is optically coupled to the second photonic module;
• a first die in communication with the first photonic module;
• and
• a second die in communication with the second photonic module,
• wherein each of the first and second photonic modules comprises:
• first and second boundaries;
• an optical distribution network;
• a first optical waveguide optically coupling the optical distribution network to a first neighboring photonic module of the plurality of photonic modules, the first neighboring photonic module being adjacent to the first boundary;
• and
• a second optical waveguide optically coupling the optical distribution network to a second neighboring photonic module of the plurality of photonic modules, the second neighboring photonic module being adjacent to the second boundary.

A computing system comprising:

• a photonic substrate patterned with a plurality of photonic modules such that the plurality of photonic modules are embedded in the photonic substrate, the plurality of photonic modules including at least first and second photonic modules, each of the first and second photonic modules being patterned according to at least one common photomask such that the first and second photonic modules share at least one common layer pattern, wherein the first photonic module is optically coupled to the second photonic module and wherein each of the first and second photonic module comprises an out-of-plane optical coupler;
• a first die optically coupled to the out-of-plane optical coupler of the first photonic module;
• and
• a second die optically coupled to the out-of-plane optical coupler of the second photonic module.