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US 11,035,050 B2Granted
Electroplating composition and electroplating method
OwnerJong Cheol Yun, Wan Joong Kim +2inventors
InventorsJong Cheol Yun, Wan Joong Kim, Hee Jeong Ryu, Seung Min Park
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Abstract
The present invention relates to a electroplating composition and an electroplating method using the same. The electroplating composition of the present invention comprising a first leveling agent and a second leveling agent, wherein the first leveling agent and the second leveling agent each, independently, comprise a compound represented by Chemical Formula 1 below:
Claims10
An electroplating composition comprising:
- a first leveling agent and a second leveling agent,
- wherein the first leveling agent is a compound represented by Chemical Formula 2, and the second leveling agent is one selected from the compounds represented by Chemical Formulas 3 to 5 below,
- wherein the weight ratio of the first leveling agent to the second leveling agent is 3:7 to 7:3
Dependencies are inferred from the claim text.