# US 11,029,596 B2 · Film mask, method for manufacturing same, and method for forming pattern using film mask and pattern formed thereby > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,029,596 B2 - Document ID: US11029596B2 - Status: Granted - Kind: B2 - Application number: 15/776,759 - Filed: 2017-01-31 - Published: 2018-12-06 - Granted: 2021-06-08 - Earliest claimed: 2016-01-27 - Assignees: LG Chem, Ltd. - Applicants: LG Chem, Ltd. - Inventors: Ji Young Hwang; Han Min Seo; Nam Seok Bae; Seung Heon Lee; Dong Hyun Oh; Jungsun You - Web page: https://patentgrep.com/patent/US11029596B2 ## CPC - G03F 1/76: Patterning of masks by imaging - G03F 1/38: Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof - G03F 1/48: Protective coatings - G03F 7/0002: {Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping} - G03F 7/20: Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) - G03F 7/70791: {Large workpieces, e.g. glass substrates for flat panel displays or solar panels} - H10P 76/40: of masks comprising inorganic materials - G03F 7/30: Imagewise removal using liquid means - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract The present application relates to a film mask comprising: a transparent substrate; a darkened light-shielding pattern layer provided on the transparent substrate; and an embossed pattern part provided on a surface of the transparent substrate, which is provided with the darkened light-shielding pattern layer, a method for manufacturing the same, a method for forming a pattern by using the same, and a pattern formed by using the same. ## Claims ### Claim 1 A film mask comprising: a transparent substrate that is a plastic film; a darkened light-shielding pattern layer; a metal layer provided between the transparent substrate and the darkened light-shielding pattern layer; an attachment layer comprising an acrylic material, an epoxy-based material, or a urethane-based material provided between the metal layer and the transparent substrate; and an embossed pattern layer provided on a surface of the transparent substrate bearing the metal layer and the darkened light-shielding pattern layer, wherein the metal layer comprises aluminum, and the darkened light-shielding pattern layer comprises aluminum oxynitride. ### Claim 2 (depends on 1) The film mask of claim 1, wherein the embossed pattern layer comprises two or more embossed patterns formed at a predetermined gap. ### Claim 3 (depends on 1) The film mask of claim 1, wherein the embossed pattern layer comprises two or more embossed patterns having the same thickness and formed at a predetermined gap. ### Claim 4 (depends on 1) The film mask of claim 1, wherein the darkened light-shielding pattern layer has a reflectance of about 30% or less in a UV region. ### Claim 5 (depends on 1) The film mask of claim 1, wherein the film mask comprises two or more regions of the metal layer where the thicknesses are different from each other or two or more regions of the darkened light-shielding pattern layer where the thicknesses are different from each other, or the film mask comprises a region where the metal layer is provided between the transparent substrate and the darkened light-shielding pattern layer and a region where the transparent substrate and the darkened light-shielding pattern layer are brought into direct contact with each other. ### Claim 6 (depends on 1) The film mask of claim 1, further comprising: a surface protective layer provided on the darkened light-shielding pattern layer. ### Claim 7 (depends on 1) The film mask of claim 1, further comprising: a release force enhancement layer provided on the darkened light-shielding pattern layer and the embossed pattern layer. ### Claim 8 (depends on 1) A method for manufacturing the film mask according to claim 1, the method comprising: forming the attachment layer comprising an acrylic, an epoxy-based material, or a urethane-based material on the transparent substrate; laminating the metal layer and the darkened light-shielding pattern layer on the attachment layer to make the metal layer provided between the transparent substrate and the darkened light-shielding pattern layer; and forming an embossed pattern layer on a surface of the transparent substrate bearing the metal layer and the darkened light-shielding pattern layer, wherein the metal layer comprises aluminum, and the darkened light-shielding pattern layer comprises aluminum oxynitride. ### Claim 9 (depends on 8) The method of claim 8, wherein the forming of the darkened light-shielding pattern layer is carried out by forming a darkened light-shielding layer using a material for forming a darkened light-shielding pattern layer on a transparent substrate, and then performing photoresist (PR) coating, UV exposure, development, etching, and stripping processes. ### Claim 10 (depends on 8) The method of claim 8, wherein the forming of the embossed pattern layer is carried out by a process of coating a bonding resin and performing UV exposure, and then coating a resin composition for forming an embossed pattern layer and performing UV exposure. ### Claim 11 (depends on 1) A method for forming a pattern, comprising: applying pressure onto one surface of a laminate comprising: a first substrate; a second substrate; a photosensitive resin composition provided between the first substrate and the second substrate; and a sealing part that seals the first substrate and second substrate together so that the photosensitive resin composition therebetween does not leak to the outside from the first substrate and the second substrate, such that the embossed pattern layer of the film mask of claim 1 is brought into contact with the laminate; exposing the laminate through the film mask; and developing an uncured resin composition in the two substrates.