# US 11,029,580 B2 · Camera module and optical device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,029,580 B2 - Document ID: US11029580B2 - Status: Granted - Kind: B2 - Application number: 16/493,983 - Filed: 2018-03-16 - Published: 2020-04-23 - Granted: 2021-06-08 - Earliest claimed: 2017-03-16 - Assignees: LG Innotek Co., Ltd. - Applicants: LG Innotek Co., Ltd. - Inventors: Ki Cheol Kim; Eun Sung Seo; Ji Sung Kim; Chang Gyun Son - Web page: https://patentgrep.com/patent/US11029580B2 ## CPC - G03B 17/12: with means for supporting objectives, supplementary lenses, filters, masks, or turrets - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D) - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION ## Abstract An embodiment of the present invention relates to a camera module and an optical device, comprising: a housing; a lens module disposed in the housing; a substrate disposed below the lens module; an image sensor disposed between the lens module and the substrate; and an optical element unit disposed between the lens module and the image sensor, wherein the optical element unit has an optical surface disposed at the top thereof, to which the light transmitted through the lens module is incident, comes in contact with a light receiving surface of the image sensor at the bottom thereof, and contains a material having a higher refractive index than air. ## Claims ### Claim 1 A camera module comprising: a housing; a lens module disposed in the housing; a substrate disposed below the lens module; an image sensor disposed between the lens module and the substrate; and an optical element unit disposed between the lens module and the image sensor, wherein the optical element unit has an optical surface disposed at the top thereof, to which the light transmitted through the lens module is incident, comes in contact with a light receiving surface of the image sensor at the bottom thereof, and contains a material having a higher refractive index than that of air, wherein the optical element unit includes an optical lens unit having the optical surface, and wherein an adhesive layer is disposed between the optical lens unit and the image sensor, the adhesive layer being in contact with the light receiving surface of the image sensor at the bottom thereof. ### Claim 2 (depends on 1) The camera module according to claim 1, wherein the optical element unit accommodates the light receiving surface of the image sensor. ### Claim 3 (depends on 1) The camera module according to claim 1, wherein the optical element unit accommodates the image sensor. ### Claim 4 (depends on 1) The camera module according to claim 1, wherein the optical element unit contains silicon. ### Claim 5 (depends on 1) The camera module according to claim 1, further comprising a package comprising a base on which the image sensor is mounted. ### Claim 6 A camera module comprising: a housing; a lens module disposed in the housing; a substrate disposed below the lens module; an image sensor disposed between the lens module and the substrate; an optical element unit disposed between the lens module and the image sensor, the optical element unit having an optical surface disposed at the top thereof, to which the light transmitted through the lens module is incident, comes in contact with a light receiving surface of the image sensor at the bottom thereof, and contains a material having a higher refractive index than that of air; and a package located between the image sensor and the substrate, the package including: a base on which the image sensor is mounted; and a sidewall portion protruding upward from the base such that the image sensor is disposed inside the sidewall portion. ### Claim 7 (depends on 6) The camera module according to claim 6, wherein the package is electrically connected to the substrate. ### Claim 8 (depends on 7) The camera module according to claim 7, wherein the optical element unit comprises: a silicon layer disposed on the top of the base and having a bottom in contact with the light receiving surface of the image sensor; and an optical lens unit having the optical surface disposed on an upper surface thereof. ### Claim 9 (depends on 8) The camera module according to claim 8, wherein the optical lens unit comprises: a body disposed on the top of the silicon layer; and a support extending from the body to the substrate and supporting the body. ### Claim 10 (depends on 9) The camera module according to claim 9, wherein the optical element unit further comprises an adhesive layer disposed between the silicon layer and the body. ### Claim 11 (depends on 7) The camera module according to claim 7, wherein the optical element unit comprises: an adhesive layer disposed on the top of the base and having a bottom in contact with the light receiving surface of the image sensor; and an optical lens unit having the optical surface disposed on an upper surface thereof. ### Claim 12 (depends on 11) The camera module according to claim 11, wherein the optical lens unit comprises: a body disposed on the top of the silicon layer; and a support extending from the body to the substrate and supporting the body. ### Claim 13 An optical device comprising: a body; a display unit disposed on one side of the body; and a camera module electrically connected to the display unit, wherein the camera module comprises: a housing; a lens module disposed inside the housing; a substrate disposed below the lens module; an image sensor disposed between the lens module and the substrate; and an optical element unit disposed between the lens module and the image sensor, wherein the optical element unit has an optical surface disposed at the top thereof, to which the light transmitted through the lens module is incident, comes in contact with a light receiving surface of the image sensor at the bottom thereof, and contains a material having a higher refractive index than air, wherein the optical element unit includes an optical lens unit having the optical surface, and wherein an adhesive layer is disposed between the optical lens unit and the image sensor, the adhesive layer being in contact with the light receiving surface of the image sensor at the bottom thereof. ### Claim 14 (depends on 13) The optical device according to claim 13, wherein the optical element unit accommodates the light receiving surface of the image sensor. ### Claim 15 (depends on 13) The optical device according to claim 13, wherein the optical element unit accommodates the image sensor. ### Claim 16 (depends on 13) The optical device according to claim 13, wherein the optical element unit contains silicon. ### Claim 17 An optical device comprising: a body; a display unit disposed on one side of the body; and a camera module electrically connected to the display unit, the camera module including: a housing; a lens module disposed inside the housing; a substrate disposed below the lens module; an image sensor disposed between the lens module and the substrate; and an optical element unit disposed between the lens module and the image sensor, the optical element unit having an optical surface disposed at the top thereof, to which the light transmitted through the lens module is incident, comes in contact with a light receiving surface of the image sensor at the bottom thereof, and contains a material having a higher refractive index than that of air; and a package located between the image sensor and the substrate, the package including: a base on which the image sensor is mounted; and a sidewall portion protruding upward from the base such that the image sensor is disposed inside the sidewall portion. ### Claim 18 (depends on 17) The optical device according to claim 17, wherein the optical element unit comprises: a silicon layer disposed on the top of the base and having a bottom in contact with the light receiving surface of the image sensor; and an optical lens unit having the optical surface disposed on an upper surface thereof. ### Claim 19 (depends on 18) The optical device according to claim 18, wherein the package is electrically connected to the substrate.