# US 11,029,546 B2 · Flexible display device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,029,546 B2 - Document ID: US11029546B2 - Status: Granted - Kind: B2 - Application number: 16/332,795 - Filed: 2019-01-24 - Published: 2021-04-29 - Granted: 2021-06-08 - Earliest claimed: 2018-12-17 - Applicants: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. - Inventors: Haifeng Wang; Shoucheng Wang; Kun Pan - Web page: https://patentgrep.com/patent/US11029546B2 ## CPC - G02F 1/13306: {Circuit arrangements or driving methods for the control of single liquid crystal cells (G02F1/132, G02F1/133382 take precedence)} - G02F 1/133305: {Flexible substrates, e.g. plastics, organic film} - G02F 1/133385: {with cooling means, e.g. fans} - G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels} - H10W 70/688: {Flexible insulating substrates} - G02F 2201/36: Airflow channels, e.g. constructional arrangements facilitating the flow of air - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A flexible display device is provided. The flexible display device includes a flexible panel including a non-bendable area, a bendable area and a plane area; a heat emission support layer positioned between the non-bendable area and the plane area, at least one groove defined in a surface of the heat emission support layer towards the plane area; a chip on film (COF), a side of the COF is connected to the plane area, a driving element positioned on a surface of the COF towards the heat emission support layer; a circuit board, a side of the circuit board is connected to the COF, another side of the circuit board is connected to the heat emission support layer, and a circuit board element positioned on a surface of the circuit board towards the heat emission support layer. the driving element and the circuit board element are positioned within the groove. ## Claims ### Claim 1 A flexible display device, comprising: a flexible panel comprising a non-bendable area, a bendable area adjacent to the non-bendable area and a plane area which is adjacent to the bendable area and which is parallel to the non-bendable area; a heat emission support layer positioned between the non-bendable area and the plane area, wherein at least one groove is defined in a side of the heat emission support layer towards the plane area; a chip on film (COF), wherein a side of the COF is connected to the plane area, and a driving element is provided on a surface of the COF towards the heat emission support layer; and a circuit board, wherein a side of the circuit board is connected to the COF and another side of the circuit board is connected to the heat emission support layer, and a circuit board element is provided on the surface of the circuit board towards the heat emission support layer; wherein the driving element and the circuit board element are positioned within the at least one groove. ### Claim 2 (depends on 1) The flexible display device according to claim 1, wherein the groove comprises a first groove corresponding to the circuit board and a second groove corresponding to the COF, the circuit board element is positioned within the first groove, and the driving element is positioned within the second groove. ### Claim 3 (depends on 2) The flexible display device according to claim 2, wherein an overlapping segment is formed between the circuit board and the COF, and the first groove and the second groove divide the heat emission support layer into a first support segment corresponding to a side of the circuit board, a second support segment corresponding to the overlapping segment between the circuit board and the COF and a third support segment corresponding to the plane area. ### Claim 4 (depends on 3) The flexible display device according to claim 3, wherein the flexible display device further comprises a third support component positioned between the third support segment and the plane area, a second support component positioned between the second support segment and the overlapping segment, and a first support component positioned between the first support segment and the circuit board. ### Claim 5 (depends on 4) The flexible display device according to claim 4, wherein the flexible display device further comprises a first guard board positioned between the non-bendable area and the heat emission support layer and a second guard board positioned between the third support component and the plane area. ### Claim 6 (depends on 5) The flexible display device according to claim 5, wherein the heat emission support layer comprises a foaming layer positioned at a side close to the non-bendable area, a heat emission layer positioned at a side close to the plane area and a graphite layer positioned between the foaming layer and the heat emission layer. ### Claim 7 (depends on 6) The flexible display device according to claim 6, wherein the groove runs through the heat emission layer and the graphite layer, or the groove runs through the heat emission layer, the foaming layer and the graphite layer. ### Claim 8 (depends on 6) The flexible display device according to claim 6, wherein the heat emission layer is made of copper foil. ### Claim 9 (depends on 1) The flexible display device according to claim 1, wherein the flexible display device further comprises an anisotropic conductive adhesive film, and the anisotropic conductive adhesive film is utilized to connect the COF to the plane area and connect the COF to the circuit board. ### Claim 10 (depends on 1) The flexible display device according to claim 1, wherein a heat emission film covers an inner wall of the groove.