# US 11,029,366 B2 · Ground disconnect detection for multiple voltage domains > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,029,366 B2 - Document ID: US11029366B2 - Status: Granted - Kind: B2 - Application number: 16/539,405 - Filed: 2019-08-13 - Published: 2021-02-18 - Granted: 2021-06-08 - Earliest claimed: 2019-08-13 - Assignees: Allegro MicroSystems, LLC - Applicants: Allegro MicroSystems, LLC - Inventors: Robert A. Briano - Web page: https://patentgrep.com/patent/US11029366B2 ## CPC - G01R 31/006: {on road vehicles, e.g. automobiles or trucks (testing of ignition installations peculiar to internal combustion engines F02P17/00)} - G01R 31/50: Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections (testing of sparking plugs H01T13/58) - G01R 31/52: Testing for short-circuits, leakage current or ground faults - H02H 5/105: {responsive to deterioration or interruption of earth connection (for preventing switching-on H02H11/001)} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - H02H: EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS (indicating or signalling undesired working conditions G01R, e.g. G01R31/00, G08B; locating faults along lines G01R31/08; emergency protective devices H01H) ## Abstract Methods and apparatus for an IC package having an impedance detector module configured to have: a first connection to a first external energy source via a first IO pin of the IC package and a second connection to a detection component. In embodiments, the detection component is configured for connection to a first ground for the first external energy source via a second IO pin of the IC package, and to a barrier component, which is configured for connection to a second ground for a second external energy source via a third IO pin of the IC package. The impedance detector module is configured to detect a disconnection or degradation of a connection to ground. ## Claims ### Claim 1 An IC package, comprising: an impedance detector module configured to have: a first connection to a first external energy source via a first IO pin of the IC package; a second connection to a detection component, which is configured for connection to a first ground for the first external energy source via a second IO pin of the IC package, and to a barrier component, which is configured for connection to a second ground for a second external energy source via a third IO pin of the IC package. ### Claim 2 (depends on 1) The IC package according to claim 1, wherein the IC package includes a fourth IO pin configured for connection to the second external energy source. ### Claim 3 (depends on 1) The IC package according to claim 1, wherein the impedance detector module includes a threshold detector for detecting a level on the second connection that is above or below a given threshold due to a disconnection in continuity of a path to the second ground. ### Claim 4 (depends on 1) The IC package according to claim 1, wherein the level corresponds to a current level. ### Claim 5 (depends on 1) The IC package according to claim 1, wherein the impedance detector module is configured to inject a signal into the detection component and the barrier component. ### Claim 6 (depends on 5) The IC package according to claim 5, wherein the detection component and the barrier component are connected in parallel. ### Claim 7 (depends on 5) The IC package according to claim 5, wherein the injected signal has a frequency corresponding to impedances of the detection and barrier capacitances. ### Claim 8 (depends on 1) The IC package according to claim 1, wherein the IC package includes a first die portion for a first voltage domain and a second die portion for a second voltage domain, wherein the first die portion and the second die portion are electrically isolated from each other. ### Claim 9 (depends on 8) The IC package according to claim 8, wherein the first and second die portions are part of a single die separated by an etched trench filled with an insulating material. ### Claim 10 (depends on 8) The IC package according to claim 8, wherein the first die portion is configured for connection to the first external energy source and the second die portion is configured for connection to the second energy source. ### Claim 11 (depends on 8) The IC package according to claim 8, wherein the first and second die portions are between upper and lower dielectric layers. ### Claim 12 (depends on 8) The IC package according to claim 8, wherein the barrier component comprises a barrier component having a first plate in the first voltage domain and a second plate in the second voltage domain. ### Claim 13 (depends on 1) The IC package according to claim 1, wherein the IC package includes a first die portion for a first voltage domain and a second die portion for a second voltage domain, wherein the first die portion and the second die portion are electrically isolated from each other, and wherein the upper dielectric layer comprises an intermetallic dielectric (IMD) layer. ### Claim 14 (depends on 1) The IC package according to claim 1, wherein the first external energy source comprises a 12V battery and the second external energy source comprises a 48V battery. ### Claim 15 A method, comprising: for an IC package, employing: an impedance detector module configured to have: a first connection to a first external energy source via a first IO pin of the IC package; a second connection to a detection component, which is configured for connection to a first ground for the first external energy source via a second IO pin of the IC package, and to a barrier component, which is configured for connection to a second ground for a second external energy source via a third IO pin of the IC package. ### Claim 16 (depends on 15) The method according to claim 15, wherein the IC package includes a fourth IO pin configured for connection to the second external energy source. ### Claim 17 (depends on 15) The method according to claim 15, wherein the impedance detector module includes a threshold detector for detecting a level on the second connection that is above or below a given threshold due to a disconnection in continuity of a path to the second ground. ### Claim 18 (depends on 15) The method according to claim 15, wherein the level corresponds to a current level. ### Claim 19 (depends on 15) The method according to claim 15, wherein the impedance detector module is configured to inject a signal into the detection component and the barrier component. ### Claim 20 (depends on 19) The method according to claim 19, wherein the detection component and the barrier component are connected in parallel. ### Claim 21 (depends on 19) The method according to claim 19, wherein the injected signal has a frequency corresponding to impedances of the detection and barrier capacitances. ### Claim 22 (depends on 15) The method according to claim 15, wherein the IC package includes a first die portion for a first voltage domain and a second die portion for a second voltage domain, wherein the first die portion and the second die portion are electrically isolated from each other. ### Claim 23 (depends on 22) The method according to claim 22, wherein the first and second die portions are part of a single die separated by an etched trench filled with an insulating material. ### Claim 24 (depends on 22) The method according to claim 22, wherein the first die portion is configured for connection to the first external energy source and the second die portion is configured for connection to the second energy source. ### Claim 25 (depends on 22) The method according to claim 22, wherein the first and second die portions are between upper and lower dielectric layers. ### Claim 26 (depends on 22) The method according to claim 22, wherein the barrier component comprises a barrier component having a first plate in the first voltage domain and a second plate in the second voltage domain. ### Claim 27 (depends on 15) The method according to claim 15, wherein the IC package includes a first die portion for a first voltage domain and a second die portion for a second voltage domain, wherein the first die portion and the second die portion are electrically isolated from each other, and wherein the upper dielectric layer comprises an intermetallic dielectric (IMD) layer. ### Claim 28 (depends on 15) The method according to claim 15, wherein the first external energy source comprises a 12V battery and the second external energy source comprises a 48V battery. ### Claim 29 An IC package, comprising: an impedance detector means for connecting to a first external energy source via a first IO pin of the IC package and for connection to a detection component, which is configured for connection to a first ground for the first external energy source via a second IO pin of the IC package, and to a barrier component, which is configured for connection to a second ground for a second external energy source via a third IO pin of the IC package; and a fourth IO pin configured for connection to the second external energy source, wherein the impedance detector means includes a threshold detector for detecting a level on the second connection that is above or below a given threshold due to a disconnection in continuity of a path to the second ground. ### Claim 30 (depends on 29) The IC package according to claim 29, wherein the impedance detector means includes a signal injector for injecting a signal into the detection component and the barrier component. ### Claim 31 (depends on 29) The IC package according to claim 29, wherein the IC package includes a first die portion for a first voltage domain and a second die portion for a second voltage domain, wherein the first die portion and the second die portion are electrically isolated from each other. ### Claim 32 (depends on 31) The IC package according to claim 31, wherein the first die portion is configured for connection to the first external energy source and the second die portion is configured for connection to the second energy source. ### Claim 33 (depends on 32) The IC package according to claim 32, wherein the barrier component comprises a barrier component having a first plate in the first voltage domain and a second plate in the second voltage domain.