# US 11,029,221 B2 · Sensor, input device, and electronic apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,029,221 B2 - Document ID: US11029221B2 - Status: Granted - Kind: B2 - Application number: 16/486,755 - Filed: 2018-02-16 - Published: 2019-12-12 - Granted: 2021-06-08 - Earliest claimed: 2017-02-17 - Assignees: Sony Corporation - Applicants: Sony Corporation - Inventors: Ken Kobayashi; Akira Ebisui; Kei Tsukamoto; Taizo Nishimura; Tetsuro Goto; Tomoki Kawabata; Makoto Yamaguchi - Web page: https://patentgrep.com/patent/US11029221B2 ## CPC - G01L 1/146: {for measuring force distributions, e.g. using force arrays (G01L1/148 takes precedence)} - G06F 1/169: {the I/O peripheral being an integrated pointing device, e.g. trackball in the palm rest area, mini-joystick integrated between keyboard keys, touch pads or touch stripes (G06F1/1643 takes precedence; constructional details of pointing devices G06F3/033)} - B32B 5/18: characterised by features of a layer {of} foamed material - B32B 7/12: using interposed adhesives or interposed materials with bonding properties - B32B 15/046: {of foam} - B32B 23/048: {of foam} - B32B 23/20: comprising esters - B32B 27/065: {of foam} - B32B 27/08: of synthetic resin - B32B 27/281: {comprising polyimides} - B32B 27/304: {comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF} - B32B 27/308: {comprising acrylic (co)polymers} - B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} - B32B 27/325: {comprising polycycloolefins} - B32B 27/34: comprising polyamides - B32B 27/36: comprising polyesters - B32B 27/365: {comprising polycarbonates} - B32B 27/38: comprising epoxy resins - B32B 27/40: comprising polyurethanes - B32B 27/42: comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines - G06F 3/044: by capacitive means - B32B 2255/06: on metal layer - B32B 2255/205: Metallic coating - B32B 2255/26: Polymeric coating - B32B 2307/51: Elastic - B32B 2307/54: Yield strength; Tensile strength - B32B 2307/732: Dimensional properties - B32B 2457/00: Electrical equipment - B32B 2457/202: LCD, i.e. liquid crystal displays - G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G) - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ## Abstract An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a first surface and a second surface; a support body supporting the pressure-sensitive sensor such that the exterior body faces the first surface; and a first deformation layer disposed at least either between the first surface and the exterior body or between the second surface and the support body. The pressure-sensitive sensor includes a capacitive sensor electrode unit including a sensing unit, a reference electrode layer, and a second deformation layer disposed between the reference electrode layer and the sensor electrode unit. The first deformation layer and the second deformation layer satisfy a predetermined relationship. ## Claims ### Claim 1 An electronic apparatus comprising: an exterior body; a pressure-sensitive sensor having a first surface and a second surface; a support body supporting the pressure-sensitive sensor such that the exterior body faces the first surface; and a first deformation layer disposed at least either between the first surface and the exterior body or between the second surface and the support body, wherein the pressure-sensitive sensor includes a capacitive sensor electrode unit including a sensing unit, a reference electrode layer, and a second deformation layer disposed between the reference electrode layer and the sensor electrode unit, and the first deformation layer and the second deformation layer satisfy at least one of relationships represented by the following formulas (1) to (3), Elastic modulus of the first deformation layer≤elastic modulus of the second deformation layer (1) Thickness of the first deformation layer≥thickness of the second deformation layer (2) Area occupancy of the first deformation layer≤area occupancy of the second deformation layer (3) ### Claim 2 (depends on 1) The electronic apparatus according to claim 1, wherein the first deformation layer and the second deformation layer each contain a foamed resin. ### Claim 3 (depends on 1) The electronic apparatus according to claim 1, wherein the first deformation layer has a shape pattern. ### Claim 4 (depends on 1) The electronic apparatus according to claim 1, wherein the exterior body contains a metal or a polymer resin. ### Claim 5 (depends on 1) The electronic apparatus according to claim 1, wherein the exterior body has a side wall portion, and the pressure-sensitive sensor and the first deformation layer are disposed on the side wall portion. ### Claim 6 (depends on 1) The electronic apparatus according to claim 1, wherein the exterior body includes a housing. ### Claim 7 (depends on 1) The electronic apparatus according to claim 1, wherein the exterior body can press the first surface by being pressed toward the first surface. ### Claim 8 (depends on 1) The electronic apparatus according to claim 1, wherein the first deformation layer and the second deformation layer satisfy at least two of the relationships represented by the above formulas (1) to (3). ### Claim 9 (depends on 1) The electronic apparatus according to claim 1, wherein the first deformation layer and the second deformation layer satisfy all the relationships represented by the above formulas (1) to (3). ### Claim 10 (depends on 1) The electronic apparatus according to claim 1, wherein the first deformation layer and the second deformation layer satisfy at least one of relationships represented by the following formulas (4) to (6), Elastic modulus of the first deformation layerthickness of the first deformation layer (5) Area occupancy of the first deformation layer