# US 11,028,971 B2 · LED filament and lamp, and manufacturing process of LED filament > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,028,971 B2 - Document ID: US11028971B2 - Status: Granted - Kind: B2 - Application number: 16/474,780 - Filed: 2019-04-28 - Published: 2020-10-15 - Granted: 2021-06-08 - Earliest claimed: 2018-11-06 - Assignees: Hangzhou Binary Optoelectronics & Tech Co., Ltd. - Applicants: Hangzhou Binary Optoelectronics & Tech. Co., Ltd. - Inventors: Gaole Zhang; Kang Zhou - Web page: https://patentgrep.com/patent/US11028971B2 ## CPC - F21K 9/235: Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps (F21K9/238 takes precedence) - F21K 9/232: specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb - F21K 9/90: Methods of manufacture - F21V 9/30: Elements containing photoluminescent material distinct from or spaced from the light source (shades F21V1/17; globes, bowls or cover glasses F21V3/08, F21V3/12; refractors F21V5/10; reflectors F21V7/26, F21V7/30; elements with provision for controlling the spectral properties or intensity F21V9/40) - F21V 19/005: {by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound} - H05K 1/0366: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)} - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 1/14: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) - H05K 1/181: associated with surface mounted components - F21Y 2107/50: on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted - F21Y 2115/10: Light-emitting diodes [LED] - H05K 2201/0108: Transparent - H05K 2201/09027: Non-rectangular flat PCB, e.g. circular - H05K 2201/09163: Slotted edge - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/10318: Surface mounted metallic pins - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract An LED filament and lamp, and a manufacturing process of an LED filament, the LED filament includes a PCB substrate and multiple LED chips, connecting circuits are provided on the PCB substrate, a positive pin and a negative pin are provided at two ends of the connecting circuit, respectively, and each LED chip is electrically connected to the connecting circuit; and a fluorescent glue layer is provided outside the PCB substrate and the LED chips, and the positive pin and the negative pin are exposed from the fluorescent glue layer. The LED lamp includes the LED filament. The manufacturing process of an LED filament enables manufacturing an LED filament. For the LED filament and lamp, and the manufacturing process of an LED filament, a PCB substrate is used as a base material, connecting circuits are fabricated on the PCB substrate, the connecting circuits are directly used for connecting LED chips. ## Claims ### Claim 1 An LED filament comprising: a PCB substrate and a plurality of LED chips, wherein the PCB substrate is a glass fiber substrate, a connecting circuit is provided on the PCB substrate, a positive pin and a negative pin are provided at two ends of the connecting circuit, respectively, and each of the LED chips is electrically connected to the connecting circuit; a fluorescent glue layer is provided outside the PCB substrate and the LED chips, and the positive pin and the negative pin are exposed from the fluorescent glue layer; and the PCB substrate further comprises electrode arms and a connecting arm, first ends of two electrode arms are connected by the connecting arm, and the other ends of the two electrode arms are provided with the positive pin and the negative pin, respectively. ### Claim 2 (depends on 1) The LED filament according to claim 1, wherein the PCB substrate can be in any two-dimensional shape. ### Claim 3 (depends on 1) The LED filament according to claim 1, wherein the positive pin and the negative pin can be provided at any positions of the PCB substrate. ### Claim 4 (depends on 1) The LED filament according to claim 1, wherein the PCB substrate is formed by cutting, with the PCB substrate formed in one piece, or the PCB substrate is formed by splicing the electrode arms and the connecting arm. ### Claim 5 (depends on 1) The LED filament according to claim 1, wherein the connecting arm is provided with a socket, and the socket is exposed from the fluorescent glue layer, and a plurality of the LED filaments are plugged into the socket and fixed to form a three-dimensional LED filament. ### Claim 6 (depends on 1) The LED filament according to claim 1, wherein the connecting circuit is made by etching. ### Claim 7 (depends on 1) The LED filament according to claim 1, wherein the PCB substrate is optically conductive and/or thermally conductive. ### Claim 8 (depends on 1) The LED filament according to claim 1, wherein the LED chips are connected to at least one side of the PCB substrate, and at least one side of the PCB substrate is provided with the fluorescent glue layer, and a content of fluorescent agent in the fluorescent glue layer is adjusted so that two sides of the LED filament have uniform light emission. ### Claim 9 (depends on 8) The LED filament according to claim 8, wherein the LED chips are connected to one side of the PCB substrate, both sides of the PCB substrate are provided with the fluorescent glue layer, and the fluorescent glue layers of two sides have different contents of fluorescent agent, so that the two sides of the LED filament have uniform light emission. ### Claim 10 (depends on 1) The LED filament according to claim 1, wherein the PCB substrate has both sides respectively provided with the connecting circuits and provided with the LED chips. ### Claim 11 (depends on 1) The LED filament according to claim 1, wherein the positive pin and the negative pin are pins that are welded on the PCB substrate and extend out from an end portion of the PCB substrate. ### Claim 12 (depends on 1) The LED filament according to claim 1, wherein the positive pin and the negative pin are formed by plating electrodes. ### Claim 13 (depends on 1) The LED filament according to claim 1, wherein the LED chips are connected to the PCB substrate by means of flip-chip, and chips connected by the flip-chip have no power connection pins. ### Claim 14 (depends on 1) The LED filament according to claim 1, wherein a protection circuit or a control circuit is further integrated on the PCB substrate. ### Claim 15 (depends on 1) The LED filament according to claim 1, wherein the PCB substrate is a glass fiber PCB substrate, which is made by using epoxy resin as an adhesive and glass fiber cloth as a reinforcing material. ### Claim 16 (depends on 1) An LED lamp, comprising a lamp holder and the LED filament according to claim 1, wherein the lamp holder is provided with a socket, and the LED filament is plugged into the socket to form a detachable electrical connection with the lamp holder. ### Claim 17 (depends on 1) A manufacturing process of an LED filament according to claim 1, comprising steps of: fabricating connecting circuits on a PCB substrate, and connecting a positive pin and a negative pin to two ends of the connecting circuit, respectively; electrically connecting LED chips to the connecting circuits and fixing the LED chips on a surface of the PCB substrate; and coating both sides of the PCB substrate with fluorescent glue to wrap the PCB substrate and the LED chips and expose the positive pin and the negative pin. ### Claim 18 (depends on 17) The manufacturing process of an LED filament according to claim 17, wherein the LED chips are connected to a single side of the PCB substrate, and a content of fluorescent agent in the fluorescent glue is adjusted so that two sides of the PCB substrate have uniform light emission. ### Claim 19 (depends on 17) The manufacturing process of an LED filament according to claim 17, wherein a plurality of the connecting circuits are fabricated on a substrate having an area larger than the LED filament, the LED chips are connected to the connecting circuits, both sides of the substrate are coated with the fluorescent glue, and after the fluorescent glue is shaped, the substrate is cut to obtain the LED filament.