# US 11,028,970 B2 · LED filament light bulb having organosilicon-modified polyimide resin composition filament base layer

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- Number: US 11,028,970 B2
- Document ID: US11028970B2
- Status: Granted
- Kind: B2
- Application number: 16/279,972
- Filed: 2019-02-19
- Published: 2019-06-20
- Granted: 2021-06-08
- Earliest claimed: 2014-09-28
- Assignees: Zhejiang Super Lighting Electric Appliance Co., Ltd
- Applicants: Zhejiang Super Lighting Electric Appliance Co., Ltd
- Inventors: Tao Jiang; Wei-Hong Xu; Yukihiro Saito; Hayato Unagiike; Ai-Ming Xiong; Jun-Feng Xu; Yi-Ching Chen
- Web page: https://patentgrep.com/patent/US11028970B2

## CPC

- F21K 9/232: specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
- F21K 9/61: using light guides
- F21V 15/04: Resilient mountings, e.g. shock absorbers {(shock absorbing devices of vehicle headlamp housings B60Q1/0491; in general F16F15/04)}
- H05B 45/00: Circuit arrangements for operating light-emitting diodes [LED]
- H05B 45/20: Controlling the colour of the light
- H05B 45/24: using electrical feedback from LEDs or from LED modules
- H05B 45/32: Pulse-control circuits
- H05B 45/345: Current stabilisation; Maintaining constant current
- H05B 45/375: using buck topology
- H05B 45/38: using boost topology
- H10H 20/80: Constructional details
- F21Y 2107/70: on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
- F21Y 2115/10: Light-emitting diodes [LED]
- H05B 45/357: specially adapted for retrofit LED light sources
- H10H 20/8511: {characterised by their material, e.g. binder}
- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 20/853: characterised by their shape
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 90/00: Package configurations
- Y02B 20/30: Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02B: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS

## Abstract

An light bulb, comprising: a lamp housing with inner surface and outer surface opposite to the inner surface of the lamp housing, the lamp housing includes a layer of luminescent material, which is formed on the inner surface or the outer surface of the lamp housing or integrated in the material of the lamp housing; a bulb base connected to the lamp housing; a stem connected to the bulb base and located in the lamp housing; and a single filament, disposed in the light housing.

## Claims

### Claim 1

An light bulb, comprising:
a lamp housing with inner surface and outer surface opposite to the inner surface of the lamp housing, the lamp housing includes a layer of luminescent material, which is formed on the inner surface or the outer surface of the lamp housing or integrated in a material of the lamp housing;
a bulb base connected to the lamp housing;
a stem connected to the bulb base and located in the lamp housing; and
a single LED filament, disposed in the light housing, the single LED filament comprising:
a plurality of LED filament units, wherein each of the plurality of LED filament units includes a single LED chip with an upper surface and a lower surface opposite to the upper surface, and
a light conversion layer comprising a top layer and a base layer, wherein the base layer comprises an upper surface and a lower surface opposite to the upper surface of the base layer, the top layer with an upper surface and a lower surface opposite to the upper surface of the top layer is disposed on at least two sides of each of the single LED chips, the lower surface of each of the single LED chips is close to the upper surface of the base layer, the upper surface of the top layer is away from each of the single LED chips;
wherein H is between a and 10 C/2 tan 0.5α, where H represents the distance from the upper surface of each of the single LED chips to the upper surface of the top layer, a represents the maximum value in both 0.5 C/2 tan 0.5α and W1/2 tan 0.5β, C represents the length of each of the plurality of LED filament units in the longitudinal direction of the single LED filament, α represents the illumination angle of each of the single LED chips in the longitudinal direction of the single LED filament, W1 represents the width of the upper surface of the base layer or the width of the lower surface of the top layer in the short axial direction of the single LED filament; β represents the illumination angle of each of the single LED chips in the short axial direction of the single LED filament; and
wherein the base layer is formed from organosilicon-modified polyimide resin composition comprising an organosilicon-modified polyimide and a thermal curing agent, wherein the organosilicon-modified polyimide comprises a repeating unit represented by the following general formula (I):
wherein Ar1 is a tetra-valent organic group having a benzene ring or an alicyclic hydrocarbon structure, Ar2 is a di-valent organic group having a monocyclic alicyclic hydrocarbon structure, R is each independently methyl or phenyl, n is 1-5, and
wherein the organosilicon-modified polyimide has a number average molecular weight of 5000-100000, and
wherein the thermal curing agent is selected from the group consisting of epoxy resin, isocyanate and bisoxazoline compounds.

### Claim 2 (depends on 1)

The light bulb of claim 1, wherein H is between A and 2 C/2 tan 0.5α, A represents the maximum value in both C/2 tan 0.5α and W1/2 tan 0.5β.

### Claim 3 (depends on 1)

The light bulb of claim 1, wherein H is between b and 2.9 C, b represents the maximum of 0.14 C and 0.28W1.

### Claim 4 (depends on 1)

The light bulb of claim 1, wherein H is between B and 0.58 C, B represents the maximum of 0.28 C and 0.28W1.

### Claim 5 (depends on 4)

The light bulb of claim 4, wherein the proportion of W1 and W2 is W1:W2=1:0.8-1:0.9, W2 represent the width of each of the single LED chip in the short axial direction of the single LED filament.

### Claim 6 (depends on 5)

The light bulb of claim 5, wherein the thickness of the base layer is smaller than that of the top layer.

### Claim 7 (depends on 6)

The light bulb of claim 6, wherein the center point of the top layer overlaps with the upper surface of the single LED chip.

### Claim 8 (depends on 7)

The light bulb of claim 7, wherein the organosilicon-modified polyimide has a number average molecular weight of 10000-60000.

### Claim 9 (depends on 8)

The light bulb of claim 8, wherein the organosilicon-modified polyimide has a number average molecular weight of 20000-40000.

### Claim 10 (depends on 9)

The light bulb of claim 9, wherein Ar1 is a tetra-valent organic group having a monocyclic alicyclic hydrocarbon structure or a bridged-ring alicyclic hydrocarbon structure.

### Claim 11 (depends on 9)

The light bulb of claim 9, wherein Ar1 is a tetra-valent organic group having a benzene ring or an alicyclic hydrocarbon structure comprising a functional group having active hydrogen, wherein the functional group having active hydrogen is any one of hydroxyl, amino, carboxy and mercapto.

### Claim 12 (depends on 11)

The light bulb of claim 11, wherein Ar2 is a di-valent organic group comprising a functional group having active hydrogen, wherein the functional group having active hydrogen is any one of hydroxyl, amino, carboxy and mercapto.

### Claim 13 (depends on 12)

The light bulb of claim 12, wherein Ar1 is derived from a dianhydride, and Ar2 is derived from a diamine.

### Claim 14 (depends on 13)

The light bulb of claim 13, wherein 5-25% by molar of the total amount of diamine comprises a functional group having active hydrogen.

### Claim 15 (depends on 14)

The light bulb of claim 14, wherein siloxane content in the organosilicon-modified polyimide is 20-75 wt %.

### Claim 16 (depends on 15)

The light bulb of claim 15, wherein siloxane content in the organosilicon-modified polyimide is 30-70 wt %, and the organosilicon-modified polyimide resin composition has a glass transition temperature of below 150° C.

### Claim 17 (depends on 16)

The light bulb of claim 16, wherein the molar ratio of the thermal curing agent to the functional group having active hydrogen in the organosilicon-modified polyimide is 1:1.

### Claim 18 (depends on 17)

The light bulb of claim 17, wherein the organosilicon-modified polyimide resin composition further comprises an additive which is selected from the group consisting of fluorescent powders, heat dispersing particles and a coupling agent.

### Claim 19 (depends on 18)

The light bulb of claim 18, wherein the weight of the heat dispersing particles is 1-12 times the weight of the organosilicon-modified polyimide.

### Claim 20 (depends on 14)

The light bulb of claim 14, wherein the molar ratio of the thermal curing agent to the functional group having active hydrogen in the organosilicon-modified polyimide is 1:1.