# US 11,028,495 B2 · Method for producing porous copper foil and porous copper foil produced by the same

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- Number: US 11,028,495 B2
- Document ID: US11028495B2
- Status: Granted
- Kind: B2
- Application number: 15/924,215
- Filed: 2018-03-18
- Published: 2018-10-04
- Granted: 2021-06-08
- Earliest claimed: 2017-03-30
- Assignees: Ymt Co., Ltd.
- Applicants: Ymt Co., Ltd.
- Inventors: Sung Wook Chun; Ik Beom Kim; Seon Gi Jeon; Dae Hoon Lee; Youn Bong Kang; Jun Mo Hong; Hyeong Gyu Park
- Web page: https://patentgrep.com/patent/US11028495B2

## CPC

- C25D 1/08: Perforated or foraminous objects, e.g. sieves (C25D1/10 takes precedence)
- C23C 18/1646: {Characteristics of the product obtained}
- C23C 18/1651: {Two or more layers only obtained by electroless plating}
- C23C 18/1653: {Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating}
- C23C 18/1657: {Electroless forming, i.e. substrate removed or destroyed at the end of the process}
- C23C 18/38: Coating with copper
- C23C 18/54: Contact plating, i.e. electroless electrochemical plating
- C23F 17/00: Multi-step processes for surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by subclass C21D or C22F or class C25 (coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups C23C2/00 - C23C26/00, or by combinations of methods providedfor in subclasses C23C and C25D, C23C28/00)
- C25D 1/04: Wires; Strips; Foils
- C25D 1/20: Separation of the formed objects from the electrodes {with no destruction of said electrodes}
- C25D 3/38: of copper
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- C23F: NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE (working metal by laser beams B23K26/00; desurfacing by applying flames B23K7/00; working of metal by electro-erosion B23H; producing decorative effects by removing surface material, e.g. by engraving, by etching, B44C1/22; electrolytic etching or polishing C25F); INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25

## Abstract

Provided is a method for producing a porous copper foil. The method includes forming a release layer on a metal carrier, growing copper islands on the metal carrier formed with the release layer by electroless copper plating, forming a porous copper thin layer by copper electroplating, and peeling off the porous copper thin layer from the release layer.

## Claims

### Claim 1

A method for producing a porous copper foil, comprising:
forming a release layer on a metal carrier, wherein the metal carrier is made of aluminum with a natural surface oxide film and the release layer is composed of a metal compound having a thickness of 10 nanometers or less;
growing copper islands on the metal carrier formed with the release layer by electroless copper plating;
forming a porous copper thin layer by copper electroplating using the metal carrier with the natural surface oxide film as an electrode to electroplate only the copper islands; and
peeling off the porous copper thin layer from the release layer.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the porous copper thin layer has a thickness of 1 to 5 microns and comprises pores having a size of 1 to 30 microns.

### Claim 3

A method for manufacturing a polymer resin sheet with surface irregularities, comprising:
forming a release layer on a metal carrier, wherein the metal carrier is made of aluminum with a natural surface oxide film and the release layer is composed of a metal compound layer having a thickness of 10 nanometers or less;
growing copper islands on the metal carrier formed with the release layer by electroless copper plating;
forming a porous copper thin layer by copper electroplating using the metal carrier with the natural surface oxide film as an electrode to electroplate only the copper islands;
applying a curable polymer onto the porous copper thin layer and curing the curable polymer;
peeling off the cured polymer and the porous copper thin layer from the release layer; and
removing the copper from the cured polymer and the porous copper thin layer.