# US 11,028,304 B2 · Thermally conductive polymer composition for a heat sink

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- Number: US 11,028,304 B2
- Document ID: US11028304B2
- Status: Granted
- Kind: B2
- Application number: 16/658,583
- Filed: 2019-10-21
- Published: 2020-02-13
- Granted: 2021-06-08
- Earliest claimed: 2016-08-08
- Assignees: Ticona LLC
- Applicants: Ticona LLC
- Inventors: Young Shin Kim
- Web page: https://patentgrep.com/patent/US11028304B2

## CPC

- C09K 5/14: Solid materials, e.g. powdery or granular
- C08L 77/06: Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence)
- F21V 29/767: {the planes containing the fins or blades having directions perpendicular to the light emitting axis}
- F21V 29/87: Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
- F28F 21/06: of plastics material
- H01B 3/40: epoxy resins
- C08L 2203/20: use in electrical or conductive gadgets
- F21Y 2115/10: Light-emitting diodes [LED]
- F28D 2021/0029: {Heat sinks}
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16)
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general)

## Abstract

A polymer composition that contains a polyamide is provided. The composition exhibits a Charpy unnotched impact strength of about 5 kJ/m2 or more as measured at a temperature of 23° C. according to ISO Test No. 179-1:2010 and an in-plane thermal conductivity of about 15 W/m-K or more as determined in accordance with ASTM E 1461-13.

## Claims

### Claim 1

A heat sink comprising a polymer composition, which comprises a polyamide and thermally conductive particulate material, wherein the thermally conductive material constitutes from about 20 wt. % to about 55 wt. % of the polymer composition, and wherein the polymer composition exhibits a Charpy unnotched impact strength of about 5 kJ/m2 or more as measured at a temperature of 23° C. according to ISO Test No. 179-1:2010 and an in-plane thermal conductivity of about 15 W/m-K or more as determined in accordance with ASTM E 1461-13.

### Claim 2 (depends on 1)

The heat sink of claim 1, wherein the polymer composition exhibits a Charpy unnotched impact strength of from about 8 to about 25 kJ/m2 as measured at a temperature of 23° C. according to ISO Test No. 179-1:2010 and an in-plane thermal conductivity of from about 20 to about 40 W/m-K as determined in accordance with ASTM E 1461-13.

### Claim 3 (depends on 2)

The heat sink of claim 2, wherein the heat sink contains a plurality of spaced apart heat-dissipating elements formed from the polymer composition.

### Claim 4 (depends on 3)

The heat sink of claim 3, wherein the heat-dissipating elements are fins.

### Claim 5 (depends on 3)

The heat sink of claim 3, wherein the heat-dissipating elements project outwardly from a base, wherein the base is formed from the polymer composition.

### Claim 6

A heat sink comprising a polymer composition, which comprises a polyamide and thermally conductive particulate material, wherein the polymer composition exhibits a Charpy unnotched impact strength of about 5 kJ/m2 or more as measured at a temperature of 23° C. according to ISO Test No. 179-1:2010, a tensile strength of 40 MPa or more as measured in accordance with ISO Test No. 527:2012, and an in-plane thermal conductivity of about 15 W/m-K or more as determined in accordance with ASTM E 1461-13.

### Claim 7

A light assembly comprising a heat sink, the heat sink comprising a polymer composition which comprises a polyamide and thermally conductive particulate material, wherein the polymer composition exhibits a Charpy unnotched impact strength of about 5 kJ/m2 or more as measured at a temperature of 23° C. according to ISO Test No. 179-1:2010, a tensile strength of 40 MPa or more as measured in accordance with ISO Test No. 527:2012, and an in-plane thermal conductivity of about 15 W/m-K or more as determined in accordance with ASTM E 1461-13.

### Claim 8 (depends on 7)

The light assembly of claim 7, wherein the assembly contains an LED module that contains one or more light emitting diodes, the heat sink being disposed in proximity to the LED module.

### Claim 9 (depends on 8)

The light assembly of claim 8, wherein the light assembly contains an outer housing, and further wherein the heat sink is located external to the housing.

### Claim 10 (depends on 8)

The light assembly of claim 8, wherein the heat sink is attached to the LED module through a connector.

### Claim 11 (depends on 8)

The light assembly of claim 8, wherein the heat sink is attached to the housing.