# US 11,028,269 B2 · Silicone-modified epoxy resin composition and semiconductor device

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- Number: US 11,028,269 B2
- Document ID: US11028269B2
- Status: Granted
- Kind: B2
- Application number: 15/971,019
- Filed: 2018-05-04
- Published: 2018-11-22
- Granted: 2021-06-08
- Earliest claimed: 2017-05-19
- Assignees: Shin-Etsu Chemical Co., Ltd.
- Applicants: Shin-Etsu Chemical Co., Ltd.
- Inventors: Norifumi Kawamura; Shoichi Osada; Kohei Otake
- Web page: https://patentgrep.com/patent/US11028269B2

## CPC

- C08G 59/1433: {with organic low-molecular-weight compounds}
- C08L 83/06: containing silicon bound to oxygen-containing groups (C08L83/12 takes precedence)
- C08G 59/1494: {followed by a further chemical treatment thereof}
- C08G 59/306: {containing silicon}
- C08G 59/3281: {containing silicon}
- C08G 59/4028: {Isocyanates; Thioisocyanates}
- C08G 59/4085: {silicon containing compounds}
- C08G 59/62: Alcohols or phenols
- C08K 5/0041: {Optical brightening agents, organic pigments}
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10W 74/476: {Organic materials comprising silicon}
- C08G 77/14: containing silicon bound to oxygen-containing groups
- C08G 77/38: Polysiloxanes modified by chemical after-treatment
- C08G 77/388: containing nitrogen
- C08G 77/80: {Siloxanes having aromatic substituents, e.g. phenyl side groups}
- C08L 2203/20: use in electrical or conductive gadgets
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The invention provides a resin composition comprising a specific silicone-modified epoxy resin, a specific silicone-modified phenolic resin, black pigment, and an inorganic filler. The invention also provides a resin composition comprising a specific cyanate ester compound, a specific silicone-modified epoxy resin, and a specific phenol compound and/or silicone-modified phenolic resin.

## Claims

### Claim 1

A silicone-modified epoxy resin composition comprising:
(A) a silicone-modified epoxy resin obtained from hydrosilylation reaction of an alkenyl-containing epoxy compound with an organopolysiloxane having the average compositional formula (1):
HaRbSiO(4-a-b)/2 (1)
wherein R is each independently a C1-C10 monovalent hydrocarbon group, a is a positive number: 0.01≤a≤1, b is a positive number: 1≤b≤3, and 1.01≤a+b<4,
(B) a silicone-modified phenolic resin obtained from hydrosilylation reaction of an alkenyl-containing phenol compound with an organopolysiloxane having the average compositional formula (1),
(C) a black pigment, and
(D) an inorganic filler exclusive of the black pigment (C),
wherein the silicone-modified epoxy resin of component (A) has the following formula (5):
and wherein the silicone-modified phenolic resin of component (B) has the following formula (7)

### Claim 2 (depends on 1)

The silicone-modified epoxy resin composition of claim 1 wherein the inorganic filler (D) is present in an amount of 150 to 1,500 parts by weight per 100 parts by weight of components (A) and (B) combined and 60 to 94% by weight of the total weight of the composition.

### Claim 3 (depends on 1)

A semiconductor device encapsulated with a cured product of the silicone-modified epoxy resin composition of claim 1.