# US 11,028,267 B2 · Curable organosilicon resin composition and semiconductor device

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- Number: US 11,028,267 B2
- Document ID: US11028267B2
- Status: Granted
- Kind: B2
- Application number: 16/457,494
- Filed: 2019-06-28
- Published: 2020-01-02
- Granted: 2021-06-08
- Earliest claimed: 2018-06-29
- Assignees: Shin-Etsu Chemical Co., Ltd.
- Applicants: Shin-Etsu Chemical Co., Ltd.
- Inventors: Tomoyuki Mizunashi
- Web page: https://patentgrep.com/patent/US11028267B2

## CPC

- C08L 83/04: Polysiloxanes
- C08G 77/44: containing only polysiloxane sequences
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- C08G 77/12: containing silicon bound to hydrogen
- C08G 77/16: to hydroxy groups
- C08G 77/20: containing silicon bound to unsaturated aliphatic groups
- C08G 77/80: {Siloxanes having aromatic substituents, e.g. phenyl side groups}
- C08L 2203/20: use in electrical or conductive gadgets
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A curable organosilicon resin composition is provided comprising (A) an organopolysiloxane of block polymer structure consisting of 30 to 80 mol % of R1SiO3/2, 10 to 70 mol % of (R1)2SiO2/2 and 0 to 30 mol % of (R1)3SiO1/2 units, having Mw of 5,000-100,000, and containing at least a part of the (R1)2SiO2/2 unit having an average number of 3 to 80 repetitions, at least two silicon-bonded alkenyl groups per molecule, 0.001 to 1.0 mol/100 g of silicon-bonded hydroxyl groups, and up to 1.0 mol/100 g of silicon-bonded alkoxy groups, (B) an organohydrogenpolysiloxane containing at least two SiH groups and at least one silicon-bonded aryl group per molecule, and (C) a hydrosilylation catalyst.

## Claims

### Claim 1

A curable organosilicon resin composition comprising:
(A) 100 parts by weight of an organopolysiloxane of block polymer structure consisting of 30 to 80 mol % of R1SiO3/2 units, 10 to 70 mol % of (R1)2SiO2/2 units, and 0 to 30 mol % of (R1)3SiO1/2 units wherein Ri is independently a hydroxyl, C2-C10 alkenyl, C1-C10 substituted or unsubstituted alkyl, C1-C10 alkoxy or C6-C10 aryl group, in which at least some of the (R1)2SiO2/2 units continuously repeat and the average number of repeating units is 3 to 80, the organopolysiloxane having a weight average molecular weight of 5,000 to 100,000 and containing at least two silicon-bonded alkenyl groups per molecule, 0.001 to 1.0 mol/100 g of silicon-bonded hydroxyl groups, and up to 1.0 mol/100 g of silicon-bonded alkoxy groups,
(B) an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms (i.e., SiH groups) and at least one silicon-bonded aryl group per molecule, in an amount to give 0.1 to 4.0 moles of SiH groups in component (B) per mole of alkenyl groups in component (A),
(C) a hydrosilylation catalyst in an amount to give 0.1 to 500 ppm of platinum group metal based on the total weight of components (A) and (B), and
(D) a cyclic polysiloxane having the formula (1):
wherein R4 is independently hydrogen, a C2-C10 alkenyl, C1-C10 substituted or unsubstituted alkyl or C6-C10 aryl group and n is an integer of 0 or 1, the cyclic polysiloxane being present in an amount of 0.1 to 30% by weight based on the total weight of components (A) and (B), and in an amount to give 0.1 to 4.0 moles of total SiH groups in components (B) and (D) per mole of total alkenyl groups in components (A) and (D) when component (D) has an alkenyl group and/or SiH group.

### Claim 2 (depends on 1)

The composition of claim 1 which cures into a cured product having a refractive index of 1.43 to 1.57 at 23° C. and 589 nm as measured according to method A of JIS K 7142-2014.

### Claim 3 (depends on 2)

A semiconductor device comprising an LED chip encapsulated with the cured organosilicon resin composition of claim 2.