# US 11,028,266 B2 · Curable organopolysiloxane composition, encapsulant and semiconductor device

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- Number: US 11,028,266 B2
- Document ID: US11028266B2
- Status: Granted
- Kind: B2
- Application number: 16/322,415
- Filed: 2016-08-12
- Published: 2019-06-27
- Granted: 2021-06-08
- Earliest claimed: 2016-08-12
- Assignees: Wacker Chemie AG
- Applicants: Wacker Chemie AG
- Inventors: Hyun-Kwan Yang; Young-Hyuk Joo; Young-Jin Kim; Arvid Kuhn
- Web page: https://patentgrep.com/patent/US11028266B2

## CPC

- C08L 83/04: Polysiloxanes
- C08G 77/08: characterised by the catalysts used
- C08G 77/70: {Siloxanes defined by use of the MDTQ nomenclature}
- C08K 5/0025: {Crosslinking or vulcanising agents; including accelerators}
- C08K 5/5415: containing at least one Si—O bond
- C08K 5/5425: containing at least one C=C bond
- C09D 183/04: Polysiloxanes
- C09J 183/04: Polysiloxanes
- H10W 74/10: characterised by their shape or disposition
- C08G 77/12: containing silicon bound to hydrogen
- C08G 77/20: containing silicon bound to unsaturated aliphatic groups
- C08G 77/80: {Siloxanes having aromatic substituents, e.g. phenyl side groups}
- C08K 9/00: Use of pretreated ingredients
- C08L 2203/206: use in coating or encapsulating of electronic parts
- C08L 2312/00: Crosslinking
- C09D 7/40: Additives
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A curable organopolysiloxane composition, a Light Emitting Diode (LED) encapsulant and a semiconductor device, employ a curable organopolysiloxane composition containing a branched organopolysiloxane bearing alkenyl groups and aryl groups, a linear organopolysiloxnae bearing terminal Si—H functionality, and a low molecular weight component having at least one alkenyl group. As an encapsulant, the composition displays improved stability.

## Claims

### Claim 1

A curable organopolysiloxane composition, consisting of:
(A) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group per molecule, and having siloxane units of the formula: RSiO3/2 where R is a substituted or unsubstituted monovalent hydrocarbon group;
(B) a linear organopolysiloxane with both terminal ends of the linear organopolysiloxane bearing silicon-bonded hydrogen atoms and having at least one silicon-bonded aryl group per molecule;
(C) a hydrosilylation catalyst; and,
(D) at least 1 parts by weight, relative to 100 parts by weight of the total of components (A) and (B), of a low molecular weight siloxane selected from the group consisting of DVi4, MVi4Q, MVi6Q2, MVi3T, and mixtures thereof, and
optionally, a crosslinking agent, a phosphor, an inorganic or organic filler, a heat stabilizer, a dye, a pigment, a flame retardant, or a solvent, or a mixture of one or more of these optional ingredients,
wherein the curable organopolysiloxane composition does not comprise a linear organopolysiloxane having at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group per molecule,
wherein the weight ratio of component (A) to component (B) is 70:30 to 90:10.

### Claim 2 (depends on 1)

The curable organopolysiloxane composition of claim 1, wherein component (A) is an organopolysiloxane of the average unit formula:
(R1R1R3SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d(XO1/2)e
where each of R1, R2, and R3 is the same or different, and is independently selected from substituted or unsubstituted monovalent hydrocarbon group, wherein at least one of R1, R2, or R3 per molecule is an alkenyl groups and at least one of R1, R2, or R3 per molecule is an aryl group,
X is a hydrogen atom or an alkyl group,
a is 0 or a positive number,
b is 0 or a positive number,
c is a positive number,
d is 0 or a positive number,
e is 0 or a positive number,
b/c is a number between 0 and 10,
a/c is a number between 0 and 0.5,
d/(a+b+c+d) is a number between 0 and 0.3, and
e/(a+b+c+d) is a number between 0 and 0.4.

### Claim 3 (depends on 1)

The curable organopolysiloxane composition of claim 1, wherein in which component (A) is an organopolysiloxane with the average unit formula:
(R1R1R3SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c
where R1 is a C1 to C12 alkyl group,
R2 is a C6 to C20 aryl group or C7 to C20 aralkyl group,
R3 is C2 to C12 alkenyl group,
a is 0 or a positive number,
b is 0 or a positive number, and
c is a positive number.

### Claim 4 (depends on 1)

The curable organopolysiloxane composition of claim 1, wherein component (B) is an organopolysiloxane of the formula:
where each R4 is the same or different and is independently selected from a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group with the exception of alkenyl groups, wherein at least one R4 per molecule is an aryl group, and n is an integer of 0 or more.

### Claim 5 (depends on 1)

The curable organopolysiloxane composition of claim 1, wherein component (D) comprises DVi4.

### Claim 6 (depends on 1)

The curable organopolysiloxane composition of claim 1, wherein the weight ratio of component (A) to component (B) is 75:25 to 85:15.

### Claim 7 (depends on 1)

The curable organopolysiloxane composition of claim 1, wherein component (D) is present in an amount of at most 10 parts by weight, relative to 100 parts by weight of the total of components (A) and (B).

### Claim 8 (depends on 1)

The curable organopolysiloxane composition of claim 1, wherein the molar ratio of the hydrosilyl group in component (B) with respect to the alkenyl group in component (A) is 1 to 1.2.

### Claim 9 (depends on 1)

The curable organopolysiloxane composition of claim 1, further comprising a crosslinking agent.

### Claim 10 (depends on 1)

An LED encapsulant comprising the curable organopolysiloxane composition of claim 1.

### Claim 11 (depends on 1)

A semiconductor device, in which semiconductor elements are coated with the cured product of the curable organopolysiloxane composition of claim 1.

### Claim 12 (depends on 11)

The semiconductor device of claim 11, wherein the semiconductor elements are light-emitting elements.

### Claim 13 (depends on 1)

The curable organopolysiloxane composition of claim 1, wherein component (D) is present in an amount of from 2 to 4 parts by weight relative to 100 parts by weight of components (A) and (B).