# US 11,028,262 B2 · Resin composition, anisotropic conductive film including the same, and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,028,262 B2 - Document ID: US11028262B2 - Status: Granted - Kind: B2 - Application number: 16/298,038 - Filed: 2019-03-11 - Published: 2019-09-19 - Granted: 2021-06-08 - Earliest claimed: 2018-03-13 - Assignees: Panasonic Intellectual Property Management Co., Ltd. - Applicants: Panasonic Intellectual Property Management Co., Ltd. - Inventors: Yuki Yoshioka; Arata Kishi - Web page: https://patentgrep.com/patent/US11028262B2 ## CPC - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - C08G 59/50: Amines - C08G 59/66: Mercaptans - C08K 3/11: Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table - C08L 71/12: Polyphenylene oxides - H01B 1/20: Conductive material dispersed in non-conductive organic material {(organic macromolecular compounds or compositions C08)} - H01B 1/22: the conductive material comprising metals or alloys - C08K 2003/0837: {Bismuth} - C08K 2201/001: Conductive additives - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) ## Abstract Disclosed is a resin composition that contains conductive particles, a resin component and a curing agent. The conductive particles contain solder, and the resin component contains an epoxy resin and a phenoxy resin. The curing agent contains a first compound having at least one thiol group and a second compound having an amino group. ## Claims ### Claim 1 A resin composition comprising: conductive particles; a resin component; and a curing agent, wherein the conductive particles consist of solder, the solder contains at least one selected from the group consisting of a tin-bismuth alloy, a tin-bismuth-indium alloy and a bismuth-indium alloy, the resin component contains an epoxy resin and a phenoxy resin, the curing agent contains a first compound having at least one thiol group and a second compound having an amino group, a total amount of the epoxy resin and the phenoxy resin in the resin component is 90 mass % or more, an amount of the phenoxy resin is 30 parts by mass to 50 parts by mass relative to 100 parts by mass of the epoxy resin, an amount of the first compound is 35 parts by mass to 70 parts by mass relative to 100 parts by mass of the epoxy resin, an amount of the second compound is 3 parts by mass to 20 parts by mass relative to 100 parts by mass of the epoxy resin, and an amount of the conductive particles is 3 mass % to 30 mass % relative to a total mass of the resin composition being taken as 100 mass %. ### Claim 2 (depends on 1) The resin composition in accordance with claim 1, wherein the mass ratio of the second compound relative to the first compound is 0.05 to 0.35. ### Claim 3 (depends on 1) The resin composition in accordance with claim 1, wherein the solder has a melting point of 85° C. or more and 100° C. or less. ### Claim 4 (depends on 1) The resin composition in accordance with claim 1, wherein the solder contains a bismuth-indium alloy. ### Claim 5 (depends on 4) The resin composition in accordance with claim 4, wherein an amount of the bismuth is in a range of 33 mass % or more and 85 mass % or less relative to a total amount of the bismuth and the indium being taken as 100 mass %. ### Claim 6 (depends on 1) An anisotropic conductive film comprising the resin composition in accordance with claim 1. ### Claim 7 (depends on 1) An electronic device comprising: a first circuit member; a second circuit member; and a connecting material that connects the first circuit member and the second circuit member, wherein the connecting material is a cured product of the resin composition in accordance with claim 1. ### Claim 8 (depends on 7) The electronic device in accordance with claim 7, wherein at least one of the first circuit member and the second circuit member includes at least one selected from the group consisting of a glass board, a glass epoxy board and a flexible printed wiring board. ### Claim 9 A resin composition consisting of: conductive particles; a resin component; and a curing agent, wherein the conductive particles contain solder, the solder contains at least one selected from the group consisting of a tin-bismuth alloy, a tin-bismuth-indium alloy and a bismuth-indium alloy, the resin component contains an epoxy resin and a phenoxy resin, the curing agent contains a first compound having at least one thiol group and a second compound having an amino group, and a total amount of the epoxy resin and the phenoxy resin in the resin component is 90 mass % or more.