# US 11,028,251 B2 · Resin composition, film, infrared cut filter, method of manufacturing infrared cut filter, solid image pickup element, infrared sensor, and camera module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,028,251 B2 - Document ID: US11028251B2 - Status: Granted - Kind: B2 - Application number: 16/547,902 - Filed: 2019-08-22 - Published: 2019-12-12 - Granted: 2021-06-08 - Earliest claimed: 2017-02-27 - Assignees: FUJIFILM Corporation - Applicants: FUJIFILM Corporation - Inventors: Suguru Samejima; Kyohei Arayama; Kazutaka Takahashi - Web page: https://patentgrep.com/patent/US11028251B2 ## CPC - C08K 5/3415: Five-membered rings - C08F 2/44: Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers - C08F 212/32: containing two or more rings - C08F 220/06: Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof - C08F 220/1807: {C7-(meth)acrylate, e.g. heptyl (meth)acrylate or benzyl (meth)acrylate} - C08F 220/365: {containing further carboxylic moieties} - C08F 222/1006: {of polyhydric alcohols or polyhydric phenols} - C08F 265/06: Polymerisation of acrylate or methacrylate esters on to polymers thereof - C08K 5/0041: {Optical brightening agents, organic pigments} - C08L 101/12: characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity (liquid crystal materials or compositions C09K19/00) - C09D 4/06: {Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond} in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00 - G02B 5/22: Absorbing filters {(G02B5/201 - G02B5/208 take precedence)} - G03F 7/0007: {Filters, e.g. additive colour filters; Components for display devices} - G03F 7/027: Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence) - G03F 7/032: with binders - G03F 7/033: the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers - G03F 7/105: having substances, e.g. indicators, for forming visible images - H10F 39/12: Image sensors - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION ## Abstract Provided is a resin composition including: an infrared absorbing pigment; and a resin having an infrared absorbing group. In addition, provided are a film that is formed using the resin composition, an infrared cut filter, a method of manufacturing an infrared cut filter, a solid image pickup element, an infrared sensor, and a camera module. ## Claims ### Claim 1 A resin composition comprising: an infrared absorbing pigment; and a resin having an infrared absorbing group; wherein the infrared absorbing group is a group having at least one structure selected from the group consisting of a pyrrolopyrrole structure, a diimmonium structure, a rylene structure, a dithiol complex structure, a triarylmethane structure, an azomethine structure, an anthraquinone structure, a dibenzofuranone structure, an oxonol structure, a squarylium structure, a croconium structure, a phthalocyanine structure, a naphthalocyanine structure, a pyrylium structure, an azulenium structure, a pyrromethene structure, and a cyanine structure. ### Claim 2 (depends on 1) The resin composition according to claim 1, wherein the infrared absorbing pigment is at least one pigment selected from the group consisting of a pyrrolopyrrole compound, a diimmonium compound, a rylene compound, a dithiol complex compound, a triarylmethane compound, an azomethine compound, an anthraquinone compound, a dibenzofuranone compound, an oxonol compound, a squarylium compound, a croconium compound, a phthalocyanine compound, a naphthalocyanine compound, a pyrylium compound, an azulenium compound, a pyrromethene compound, and a cyanine compound. ### Claim 3 (depends on 1) The resin composition according to claim 1, wherein the resin having an infrared absorbing group further includes a steric repulsive group. ### Claim 4 (depends on 1) The resin composition according to claim 1, wherein a weight-average molecular weight of the resin having an infrared absorbing group is 5,000 to 100,000. ### Claim 5 (depends on 1) The resin composition according to claim 1, further comprising: a curable compound. ### Claim 6 (depends on 5) The resin composition according to claim 5, further comprising: a photopolymerization initiator. ### Claim 7 (depends on 5) The resin composition according to claim 5, further comprising: an alkali-soluble resin. ### Claim 8 (depends on 1) A film which is formed using the resin composition according to claim 1. ### Claim 9 (depends on 5) A film which is formed by curing the resin composition according to claim 5. ### Claim 10 An infrared cut filter comprising: a film that includes an infrared absorbing pigment and a resin having an infrared absorbing group; wherein the infrared absorbing group is a group having at least one structure selected from the group consisting of a pyrrolopyrrole structure, a diimmonium structure, a rylene structure, a dithiol complex structure, a triarylmethane structure, an azomethine structure, an anthraquinone structure, a dibenzofuranone structure, an oxonol structure, a squarylium structure, a croconium structure, a phthalocyanine structure, a naphthalocyanine structure, a pyrylium structure, an azulenium structure, a pyrromethene structure, and a cyanine structure. ### Claim 11 (depends on 5) A method of manufacturing an infrared cut filter comprising: applying the resin composition according to claim 5 to a support to form a composition layer; exposing the composition layer in a pattern shape; and forming a pattern by removing a portion that is not exposed during the exposure by development. ### Claim 12 A method of manufacturing an infrared cut filter comprising: forming a layer that includes an infrared absorbing pigment and a resin having an infrared absorbing group on a support; forming a photoresist layer on the layer; obtaining a resist pattern by patterning the photoresist layer by exposure and development; and dry-etching the layer by using the resist pattern as an etching mask. ### Claim 13 A solid image pickup element comprising: a film that includes an infrared absorbing pigment and a resin having an infrared absorbing group; wherein the infrared absorbing group is a group having at least one structure selected from the group consisting of a pyrrolopyrrole structure, a diimmonium structure, a rylene structure, a dithiol complex structure, a triarylmethane structure, an azomethine structure, an anthraquinone structure, a dibenzofuranone structure, an oxonol structure, a squarylium structure, a croconium structure, a phthalocyanine structure, a naphthalocyanine structure, a pyrylium structure, an azulenium structure, a pyrromethene structure, and a cyanine structure. ### Claim 14 An infrared sensor comprising: a film that includes an infrared absorbing pigment and a resin having an infrared absorbing group; wherein the infrared absorbing group is a group having at least one structure selected from the group consisting of a pyrrolopyrrole structure, a diimmonium structure, a rylene structure, a dithiol complex structure, a triarylmethane structure, an azomethine structure, an anthraquinone structure, a dibenzofuranone structure, an oxonol structure, a squarylium structure, a croconium structure, a phthalocyanine structure, a naphthalocyanine structure, a pyrylium structure, an azulenium structure, a pyrromethene structure, and a cyanine structure. ### Claim 15 (depends on 10) A camera module comprising: a solid image pickup element; and the infrared cut filter according to claim 10. ### Claim 16 (depends on 1) The resin composition according to claim 1, wherein the infrared absorbing group is a group having at least one structure selected from the group consisting of a pyrrolopyrrole structure, a squarylium structure, a cyanine structure, a croconium structure, and a naphthalocyanine structure. ### Claim 17 (depends on 1) The resin composition according to claim 1, wherein a resin structure in the resin having an infrared absorbing group has at least one structure selected from the group consisting of an acrylic resin structure, a styrene resin structure, a polyester resin structure, a polyacrylonitrile resin structure, a polycarbonate resin structure, a polyamide resin structure, a polyurethane resin structure, a para-hydroxy styrene resin structure, an epoxy resin structure, a novolac resin structure, and a polyalkylene glycol structure. ### Claim 18 (depends on 1) The resin composition according to claim 1, wherein a resin structure in the resin having an infrared absorbing group has at least one structure selected from the group consisting of an acrylic resin structure, a styrene resin structure, a polyester resin structure, and a polyalkylene glycol structure. ### Claim 19 (depends on 1) The resin composition according to claim 1, wherein the resin having an infrared absorbing group further includes a steric repulsive group that is a polyester resin structure. ### Claim 20 (depends on 1) The resin composition according to claim 1, wherein the resin having an infrared absorbing group further includes a steric repulsive group, and the steric repulsive group is a polyester resin structure or a polyalkylene glycol structure. ### Claim 21 (depends on 1) The resin composition according to claim 1, wherein the infrared absorbing pigment is at least one pigment selected from the group consisting of a pyrrolopyrrole compound, a squarylium compound, a cyanine compound, a croconium compound, and a naphthalocyanine compound. ### Claim 22 (depends on 1) The resin composition according to claim 1, wherein the resin having an infrared absorbing group is a resin that includes a constitutional unit having an infrared absorbing group. ### Claim 23 (depends on 1) The resin composition according to claim 1, wherein the infrared absorbing pigment is a pyrrolopyrrole compound having a diarylborane structure. ### Claim 24 (depends on 1) The resin composition according to claim 1, wherein the resin having an infrared absorbing group has a pyrrolopyrrole structure having a diarylborane structure. ### Claim 25 (depends on 1) The resin composition according to claim 1, wherein the infrared absorbing group is a group that has the same π-conjugated plane structure as that of the infrared absorbing pigment. ### Claim 26 (depends on 1) The resin composition according to claim 1, wherein a content of the infrared absorbing pigment is from 1 mass % to 50 mass % with respect to a total solid content of the resin composition. ### Claim 27 (depends on 1) The resin composition according to claim 1, wherein a content of the resin having an infrared absorbing group is from 0.1 mass % to 30 mass % with respect to a total solid content of the resin composition. ### Claim 28 (depends on 7) The resin composition according to claim 7, wherein the alkali-soluble resin is at least one resin selected from the group consisting of a polyhydroxystyrene resin, a polysiloxane resin, an acrylic resin, an acrylamide resin, an acryl/acrylamide copolymer resin, and a resin that includes a constitutional unit represented by the following Formula (ED): wherein, in Formula (ED), RE1 and RE2 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent; and z represents 0 or 1. ### Claim 29 (depends on 5) The resin composition according to claim 5, wherein the curable compound is an ethylenically unsaturated compound.