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US 11,028,003 B2Granted
Method and device for laser-based machining of flat substrates
AssigneeCorning Laser Technologies GmbH
InventorsRichard Grundmueller, Helmut Schillinger
Life of this patent
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Abstract
A method for laser-based machining of a flat substrate, to separate the substrate into a plurality of sections, in which the laser beam of a laser is directed at the substrate using an optical arrangement, which is positioned in the beam path of the laser. The optical arrangement forms a laser beam focal line that is extended as viewed along the beam direction and the substrate is positioned relative to the laser beam focal line such that an induced absorption is produced in the material of the substrate along a section of the laser beam focal line that is extended as viewed in the beam direction.
Claims39
A system comprising:
- a substrate;
- and
- a device for laser-based machining that is configured to separate the substrate into a plurality of pieces, the device comprising:
- a laser providing a laser beam for machining the substrate when directed at the substrate, the wavelength λ of the laser beam being such that a material of the substrate is transparent to the wavelength λ;
- and
- an optical arrangement positioned in a beam path of the laser, wherein:
- the optical arrangement comprises a first optical element and a second optical element;
- the second optical element is disposed on the beam output side of the first optical element, at a distance z1 from the first optical element;
- and
- the first optical element and the second optical element are positioned and directed such that the laser beam strikes the second optical element in a ring shape, and a laser beam focal line extending along the direction of the laser beam is generated on the beam output side of the second optical element at a spacing z2 from the second optical element;
- wherein:
- the substrate is positioned relative to the laser beam focal line so that in the material of the substrate, an induced absorption takes place along a segment of the laser beam focal line that is extended as viewed in the direction of the beam along a single continuous cracking zone, wherein an induced crack formation is produced in the material of the substrate along the said extended segment.
9 more elements
A system comprising:
- a substrate;
- and
- a device for laser-based machining, the device comprising:
- a laser providing a laser beam of wavelength λ, such that a material of the substrate is transparent to the wavelength λ, a decrease in intensity of the laser beam taking place along the direction of the laser beam in the material of the substrate per millimeter of the depth of penetration is 10% or less,
- an optical arrangement which is positioned in a path of rays of the laser beam, wherein:
- the optical arrangement comprises a first optical element and a second, focusing optical element disposed on the beam output side of the first optical element at a distance z1 from the first optical element;
- and
- the first optical element and the second, focusing optical element are positioned and directed such that the laser beam strikes the second, focusing optical element is a ring shape, and a laser beam focal line extending along the direction of the laser beam is generated on the beam output side of the second, focusing optical element at a spacing z2 from the second, focusing optical element;
- wherein:
- the substrate comprises two opposite substrate surfaces and is positioned in relation to the laser beam focal line such that an extended segment of the induced absorption takes place in the material of the substrate along a single continuous cracking zone, such that induced crack formation is brought about in the material of the substrate along the extended segment of induced absorption;
- the laser beam focal line extends up to at least one of the two opposite substrate surfaces,
- the average diameter δ of the laser beam focal line is between 0.5 μm and 5 μm, and
- the average laser power, measured directly on the output side of the laser beam is between 10 watts and 100 watts.
10 more elements
Dependencies are inferred from the claim text.