# US 11,027,967 B2 · Deformable membrane and a compensating structure thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,027,967 B2 - Document ID: US11027967B2 - Status: Granted - Kind: B2 - Application number: 16/108,858 - Filed: 2018-08-22 - Published: 2019-11-14 - Granted: 2021-06-08 - Earliest claimed: 2018-04-09 - Assignees: InvenSense, Inc. - Applicants: InvenSense, Inc. - Inventors: Chung-Hsien Lin; Joseph Seeger; Calin Miclaus; Tsung Lin Tang; Pei-Wen Yen - Web page: https://patentgrep.com/patent/US11027967B2 ## CPC - B81B 3/0078: {Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075} - G01L 19/04: Means for compensating for effects of changes of temperature {, i.e. other than electric compensation} - B81C 1/00182: {Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer} - G01L 9/0045: {Diaphragm associated with a buried cavity} - G01L 9/0048: {Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief} - G01L 9/0072: {using variations in capacitance} - B81B 2201/0235: Accelerometers - B81B 2201/0242: Gyroscopes - B81B 2201/0264: Pressure sensors - B81B 2201/0292: Sensors not provided for in B81B2201/0207 - B81B2201/0285 - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) ## Abstract A sensor includes a substrate, an electrode, a deformable membrane, and a compensating structure. The substrate includes a first side and a second side. The first side is opposite to the second side. The substrate comprises a cavity on the first side. The electrode is positioned at a bottom of the cavity on the first side of the substrate. The deformable membrane is positioned on the first side of the substrate. The deformable membrane encloses the cavity and deforms responsive to external stimuli. The compensation structure is connected to outer periphery of the deformable membrane. The compensation structure creates a bending force that is opposite to a bending force of the deformable membrane responsive to temperature changes and thermal coefficient mismatch. ## Claims ### Claim 1 A sensor comprising: a substrate; an oxide layer disposed on the substrate; a deformable membrane disposed on the oxide layer, wherein the deformable membrane, the oxide layer, and the substrate forms an enclosed cavity therein, wherein the deformable membrane deforms responsive to stimuli, and wherein the oxide layer forms side walls of the enclosed cavity; an electrode positioned at a bottom of the cavity; and a compensation structure connected to the deformable membrane, wherein the compensation structure creates a compensation force that is opposite to a bending force of the deformable membrane responsive to temperature changes and thermal coefficient mismatch. ### Claim 2 (depends on 1) The sensor as described in claim 1, wherein the compensation structure is connected to the substrate. ### Claim 3 (depends on 1) The sensor as described in claim 1, wherein the compensation structure is disposed over the oxide layer. ### Claim 4 (depends on 1) The sensor as described in claim 1, wherein the compensating structure is connected to an outer periphery of the deformable membrane. ### Claim 5 (depends on 1) The sensor as described in claim 1, wherein the compensating structure is disposed on the deformable membrane. ### Claim 6 (depends on 1) The sensor as described in claim 1, wherein the compensation structure is positioned between the deformable membrane and the substrate. ### Claim 7 (depends on 1) The sensor as described in claim 1, wherein the compensation structure is ring shaped. ### Claim 8 (depends on 1) The sensor as described in claim 1, wherein the compensation structure comprises a plurality of rings. ### Claim 9 (depends on 8) The sensor as described in claim 8, wherein the plurality of rings have a gap in between. ### Claim 10 (depends on 1) The sensor as described in claim 1, wherein the compensation structure is selected from a group consisting of aluminum, copper, dielectric, polysilicon, Ti, Tungsten, Platinum, molybdenum, silicon, and nitride. ### Claim 11 A sensor comprising: a substrate comprising a cavity therein; an electrode positioned at a bottom of the cavity of the substrate; a deformable membrane positioned on the substrate, wherein the deformable membrane encloses the cavity, wherein the deformable membrane deforms responsive to external stimuli; and a compensation structure coupled to the deformable membrane, wherein the compensation structure and the deformable membrane are on different planes, and wherein the compensation structure creates a compensation force that is opposite to a bending force of the deformable membrane responsive to temperature changes and thermal coefficient mismatch. ### Claim 12 (depends on 11) The sensor as described in claim 11, wherein the compensation structure is connected to the deformable membrane and the substrate. ### Claim 13 (depends on 12) The sensor as described in claim 12, wherein the compensation structure is connected to an oxide layer of the substrate. ### Claim 14 (depends on 11) The sensor as described in claim 11, wherein the compensation structure is positioned between the deformable membrane and the substrate. ### Claim 15 (depends on 11) The sensor as described in claim 11, wherein the compensation structure is ring shaped. ### Claim 16 (depends on 11) The sensor as described in claim 11, wherein the compensation structure is selected from a group consisting of aluminum, copper, dielectric, polysilicon, Ti, Tungsten, Platinum, molybdenum, silicon, and nitride. ### Claim 17 A method comprising: forming an electrode on a substrate; selectively forming an oxide layer on a portion of the substrate; forming a deformable membrane on the formed oxide layer, wherein the deformable membrane and the formed oxide layer forms a sealed cavity therein, wherein the deformable membrane deforms responsive to external stimuli; and forming a compensation structure on the deformable membrane, wherein the compensation structure creates a compensation force that is opposite to a bending force of the deformable membrane responsive to temperature changes and thermal coefficient mismatch. ### Claim 18 (depends on 17) The method as described in claim 17, wherein the compensation structure is selected from a group consisting of aluminum, copper, dielectric, polysilicon, Ti, Tungsten, Platinum, molybdenum, silicon, and nitride. ### Claim 19 (depends on 17) The method as described in claim 17 further comprising: forming another electrode on the deformable membrane. ### Claim 20 (depends on 17) The method as described in claim 17, wherein the compensation structure is connected to the oxide layer. ### Claim 21 (depends on 1) The sensor as described in claim 1, wherein the compensation structure is disposed within the enclosed cavity. ### Claim 22 (depends on 1) The sensor as described in claim 1, wherein the compensation structure is continuous. ### Claim 23 (depends on 1) The sensor as described in claim 1, wherein the compensation structure has a gap therebetween. ### Claim 24 (depends on 1) The sensor as described in claim 1, wherein the compensation structure is formed on an outer periphery of the deformable membrane. ### Claim 25 (depends on 1) The sensor as described in claim 1, wherein the deformable membrane is in physical contact with the oxide layer. ### Claim 26 (depends on 11) The sensor as described in claim 11, wherein the deformable membrane is in physical contact with the oxide layer. ### Claim 27 (depends on 17) The method as described in claim 17, wherein the deformable membrane is in physical contact with the oxide layer.