# US 11,027,549 B2 · Bonding structure, head module, head device, and liquid discharge apparatus

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- Number: US 11,027,549 B2
- Document ID: US11027549B2
- Status: Granted
- Kind: B2
- Application number: 16/697,381
- Filed: 2019-11-27
- Published: 2020-06-04
- Granted: 2021-06-08
- Earliest claimed: 2018-11-30
- Assignees: Ricoh Company, Ltd.
- Applicants: Takashi Kinokuni
- Inventors: Takashi Kinokuni
- Web page: https://patentgrep.com/patent/US11027549B2

## CPC

- B41J 2/14201: {Structure of print heads with piezoelectric elements}
- B41J 2/1607: {Production of print heads with piezoelectric elements (B41J2/1606, B41J2/162 take precedence)}
- B41J 2/1623: {bonding and adhesion}
- B41J 2002/14459: {Matrix arrangement of the pressure chambers}
- B41J 2202/19: Assembling head units
- B41J 2202/20: Modules
- B41J 2202/21: Line printing
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS

## Abstract

A bonding structure includes a first part including a first bonding surface and a second part including a second bonding surface to be bonded to the first bonding surface of the first part with a first adhesive and a second adhesive different from the first adhesive. At least one of the first bonding surface and the second bonding surface includes a first region on which the first adhesive is applied, a second region on which the second adhesive is applied, and a third region disposed between the first region and the second region, the third region having a water repellency higher than a water repellency of each of the first region and the second region.

## Claims

### Claim 1

A head module comprising:
a liquid discharge head configured to discharge a liquid; and
a nozzle cover to which the liquid discharge head is bonded,
wherein the liquid discharge head includes:
a nozzle plate including a nozzle through which the liquid is discharged and a first bonding surface; and
an actuator substrate including an actuator configured to generate energy to discharge the liquid from the nozzle, and
wherein the nozzle cover includes an opening, configured to expose the nozzle in the nozzle plate, and a second bonding surface, to be bonded to the first bonding surface of the nozzle plate with a first adhesive and a second adhesive, different from the first adhesive, and
wherein at least one of the first bonding surface and the second bonding surface includes:
a first region on which the first adhesive is applied;
a second region on which the second adhesive is applied; and
a third region, disposed between the first region and the second region, the third region having a water repellency relatively higher than a water repellency of the first region and a water repellency of the second region.

### Claim 2 (depends on 1)

The head module of claim 1, further comprising a plurality of liquid discharge heads, the plurality of liquid discharge heads including the liquid discharge head,
wherein the plurality of liquid discharge heads are attached to the nozzle cover.

### Claim 3 (depends on 2)

A head device including a plurality of head modules, the plurality of head modules including the head module of claim 2.

### Claim 4 (depends on 3)

A liquid discharge apparatus comprising the head device of claim 3.

### Claim 5 (depends on 1)

The head module of claim 1,
wherein at least one of the first bonding surface and the second bonding surface includes:
an outer first region, arranged on an opposite side of the third region and arranged across the first region,
an inner second region arranged on an opposite side of the third region and arranged across the second region, and
the outer first region and the inner second region each having a water repellency relatively higher than the water repellency of the first region and the water repellency of the second region.

### Claim 6 (depends on 1)

The head module of claim 1,
wherein one of the first bonding surface and the second bonding surface includes two or more stepped surfaces having relatively different distances from another of the first bonding surface and the second bonding surface, and
the first region and the second region are arranged at relatively different stepped surfaces.

### Claim 7 (depends on 1)

The head module of claim 1,
wherein the first adhesive is an adhesive cured in a room temperature environment, and
the second adhesive is a thermosetting adhesive.

### Claim 8

A head module comprising:
a liquid discharge head configured to discharge a liquid; and
a nozzle cover, to which the liquid discharge head is bonded,
wherein the liquid discharge head includes:
a nozzle plate, including a nozzle, through which the liquid is discharged; and
an actuator substrate, including an actuator, configured to generate energy to discharge the liquid from the nozzle and a first bonding surface, and
wherein the nozzle cover includes an opening, configured to expose the nozzle in the nozzle plate, and a second bonding surface, to be bonded to the first bonding surface of the actuator substrate with a first adhesive and a second adhesive, different from the first adhesive, and
wherein at least one of the first bonding surface and the second bonding surface includes:
a first region on which the first adhesive is applied;
a second region on which the second adhesive is applied; and
a third region, disposed between the first region and the second region, the third region having a water repellency relatively higher than a water repellency of the first region and a water repellency of the second region.

### Claim 9 (depends on 8)

The head module of claim 8, further comprising a plurality of liquid discharge heads, the plurality of liquid discharge heads including the liquid discharge head,
wherein the plurality of liquid discharge heads is attached to the nozzle cover.

### Claim 10 (depends on 9)

A head device, including a plurality of head modules, the plurality of head modules including the head module according to claim 9.

### Claim 11 (depends on 10)

A liquid discharge apparatus comprising the head device according to claim 10.

### Claim 12 (depends on 8)

The head module of claim 8,
wherein at least one of the first bonding surface and the second bonding surface includes:
an outer first region, arranged on an opposite side of the third region and arranged across the first region,
an inner second region arranged on an opposite side of the third region and arranged across the second region, and
the outer first region and the inner second region each having a water repellency relatively higher than the water repellency of the first region and the water repellency of the second region.

### Claim 13 (depends on 8)

The head module of claim 8,
wherein one of the first bonding surface and the second bonding surface includes two or more stepped surfaces having relatively different distances from another of the first bonding surface and the second bonding surface, and
the first region and the second region are arranged at relatively different stepped surfaces.

### Claim 14 (depends on 8)

The head module of claim 8,
wherein the first adhesive is an adhesive cured in a room temperature environment, and
the second adhesive is a thermosetting adhesive.