Film cutting apparatus
AssigneeSamsung Display Co., Ltd.
InventorJae Suk Song
Life of this patent
Estimating the term…
Abstract
A film cutting apparatus includes: a punch plate including a first punch protruded on an upper surface and a second punch protruded on a lower surface; a first die plate having a first hole corresponding to the first punch, the first die plate providing a surface on which a film is provided; a second die plate having a second hole corresponding to the second punch, the second die plate providing a surface on which a film is provided; at least two guide bars penetrating the first die plate and the punch plate and fixed to the second die plate; a first elastic member between the first die plate and the punch plate; a second elastic member between the punch plate and the second die plate; and an elevator configured to press the first die plate.
Claims11
A film cutting apparatus comprising:
- a punch plate including a first punch protruded on an upper surface and a second punch protruded on a lower surface;
- a first die plate having a first hole corresponding to the first punch, the first die plate providing a surface on which a first film is provided;
- a second die plate having a second hole corresponding to the second punch, the second die plate providing a surface on which a second film is provided;
- at least two guide bars penetrating the first die plate and the punch plate and fixed to the second die plate;
- a first elastic member between the first die plate and the punch plate;
- a second elastic member between the punch plate and the second die plate;
- and
- an elevator configured to press the first die plate,
- wherein a length of the first elastic member is greater than that of the second elastic member.
A film cutting apparatus comprising:
- a first punch plate including a first punch protruded on an upper surface;
- a first die plate having a first hole corresponding to the first punch, the first die plate providing a surface on which a first film is provided;
- a second punch plate below the first punch plate and having a second punch protruded on a lower surface;
- a second die plate having a second hole corresponding to the second punch, the second die plate providing a surface on which a second film is provided;
- at least two guide bars penetrating the first die plate, the first punch plate and the second punch plate and fixed to the second die plate;
- a first elastic member between the first die plate and the first punch plate;
- a second elastic member between the second punch plate and the second die plate;
- and
- an elevator configured to press the first die plate,
- wherein a length of the first elastic member is greater than that of the second elastic member.
A film cutting apparatus comprising:
- a punch plate including a first punch protruded on an upper surface and a second punch protruded on a lower surface;
- a first die plate having a first hole corresponding to the first punch, the first die plate providing a surface on which a first film is provided;
- a second die plate having a second hole corresponding to the second punch, the second die plate providing a surface on which a second film is provided;
- at least two guide bars penetrating the first die plate and the punch plate and fixed to the second die plate;
- a first elastic member between the first die plate and the punch plate;
- a second elastic member between the punch plate and the second die plate;
- and
- an elevator configured to press the first die plate,
- wherein an elastic modulus of the first elastic member is larger than that of the second elastic member.
Dependencies are inferred from the claim text.