# US 11,027,374 B2 · Particles, connecting material and connection structure

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- Number: US 11,027,374 B2
- Document ID: US11027374B2
- Status: Granted
- Kind: B2
- Application number: 15/767,820
- Filed: 2016-11-18
- Published: 2018-11-08
- Granted: 2021-06-08
- Earliest claimed: 2015-11-20
- Assignees: Sekisui Chemical Co., Ltd.
- Applicants: Sekisui Chemical Co., Ltd.
- Inventors: Mai Yamagami; Satoshi Haneda; Takeshi Wakiya; Yasuyuki Yamada; Saori Ueda; Masao Sasadaira
- Web page: https://patentgrep.com/patent/US11027374B2

## CPC

- B23K 35/3613: {Polymers, e.g. resins}
- B22F 1/18: Non-metallic particles coated with metal
- B22F 7/064: {using an intermediate powder layer}
- B22F 7/08: with one or more parts not made from powder {(B22F7/062 takes precedence)}
- B23K 35/0244: {Powders, particles or spheres; Preforms made therefrom}
- B23K 35/025: {Pastes, creams or slurries}
- B23K 35/3006: {Ag as the principal constituent}
- C08F 12/36: Divinylbenzene
- C08F 16/32: Monomers containing two or more unsaturated aliphatic radicals
- C08F 30/08: containing silicon
- C08F 36/08: Isoprene
- C08F 36/20: unconjugated
- C08F 212/36: Divinylbenzene
- C08F 216/06: Polyvinyl alcohol {; Vinyl alcohol}
- C08J 3/12: Powdering or granulating
- C09J 9/02: Electrically-conducting adhesives
- C09J 201/00: Adhesives based on unspecified macromolecular compounds
- H01B 5/00: Non-insulated conductors or conductive bodies characterised by their form
- H01R 11/01: characterised by the form or arrangement of the conductive interconnection between the connecting locations
- B22F 1/05: Metallic powder characterised by the size or surface area of the particles
- B22F 1/052: characterised by a mixture of particles of different sizes or by the particle size distribution
- B22F 1/10: Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B23K 2101/40: Semiconductor devices
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

## Abstract

Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming the connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 μm or more and 15 μm or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 K/mm2 or less, and the particles have a particle diameter CV value of 50% or less.

## Claims

### Claim 1

A connecting material comprising:
resin particles; and
metal atom-containing particles,
the resin particles having an average particle diameter of 0.1 μm or more and 15 μm or less,
the resin particles having a 10% K value of exceeding 3000 N/mm2 and 20000 N/mm2 or less,
the resin particles having a particle diameter CV value of 50% or less,
the resin particles having a thermal decomposition temperature of 200° C. or more, and
the metal atom-containing particles being metal atom-containing particles that are capable of being sintered by heating at less than 400° C.

### Claim 2 (depends on 1)

The connecting material according to claim 1, wherein
the number of aggregated particles per million particles of the resin particles is 100 or less.

### Claim 3 (depends on 1)

The connecting material according to claim 1, wherein
a material for the resin particles contains a vinyl compound, a (meth)acrylic compound, an α-olefin compound, a diene compound, or a silicone compound.

### Claim 4 (depends on 1)

The connecting material according to claim 1, further comprising:
a resin.

### Claim 5 (depends on 1)

The connecting material according to claim 1, wherein
the thermal decomposition temperature of the resin particles is higher than a melting point of the metal atom-containing particles.

### Claim 6 (depends on 1)

A connection structure, comprising:
a first member to be connected;
a second member to be connected; and
a connection part that connects the first member to be connected and the second member to be connected,
a material for the connection part being the connecting material according to claim 1.