# US 11,027,371 B2 · Laser applying mechanism

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- Number: US 11,027,371 B2
- Document ID: US11027371B2
- Status: Granted
- Kind: B2
- Application number: 16/145,860
- Filed: 2018-09-28
- Published: 2019-04-04
- Granted: 2021-06-08
- Earliest claimed: 2017-10-03
- Assignees: Disco Corporation
- Applicants: Disco Corporation
- Inventors: Keiji Nomaru
- Web page: https://patentgrep.com/patent/US11027371B2

## CPC

- B23K 26/032: {using optical means}
- B23K 26/40: taking account of the properties of the material involved
- B23K 26/0622: by shaping pulses
- B23K 26/0648: {comprising lenses}
- B23K 26/38: by boring or cutting
- G02B 27/283: {used for beam splitting or combining}
- G02F 1/33: Acousto-optical deflection devices {(circuit or control arrangements therefor G02F1/113)}
- H01S 3/1003: {tunable optical elements, e.g. acousto-optic filters, tunable gratings}
- H01S 3/10046: {Pulse repetition rate control (H01S3/11 takes precedence)}
- H01S 3/10061: {Polarization control}
- H01S 3/2308: {Amplifier arrangements, e.g. MOPA}
- B23K 26/0853: {Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane}
- B23K 2101/40: Semiconductor devices
- B23K 2101/42: Printed circuits
- B23K 2103/56: {being semiconducting}
- H01S 3/08009: {using a diffraction grating}
- H01S 3/2383: {Parallel arrangements}
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL

## Abstract

A laser applying mechanism which has a laser oscillator adapted to oscillate a pulsed laser and to emit a linearly polarized pulsed laser beam. The laser applying mechanism includes: a polarization plane composing unit adapted to selectively synthesize a pulsed laser beam having a second polarization plane rotated by 90 degrees with respect to a pulsed laser beam having a first polarization plane which is emitted from the laser oscillator; an amplifier adapted to amplify a power of the pulsed laser beam composed by the polarization plane composing unit; and a pulsed laser beam extracting unit adapted to extract a pulsed laser beam having a polarization plane to be utilized, from among the pulsed laser beam having the first polarization plane and the pulsed laser beam having the second polarization plane which are contained in the pulsed laser beam amplified by the amplifier.

## Claims

### Claim 1

A laser applying mechanism having a laser oscillator adapted to oscillate a pulsed laser and to emit a linearly polarized pulsed laser beam, the laser applying mechanism comprising:
polarization plane composing means selectively composing a pulsed laser beam having a second polarization plane rotated by 90 degrees with respect to a pulsed laser beam having a first polarization plane emitted from the laser oscillator;
an amplifier adapted to amplify a power of the pulsed laser beam composed by the polarization plane composing means; and
pulsed laser beam extracting means configured to receive the pulsed laser beam amplified by the amplifier and extracting a pulsed laser beam having a polarization plane to be utilized, from the pulsed laser beam having the first polarization plane and the pulsed laser beam having the second polarization plane which are contained in the pulsed laser beam amplified by the amplifier; and
a condenser configured to receive and condense the pulsed laser beam having a polarization plane to be utilized, to a wafer.

### Claim 2 (depends on 1)

The laser applying mechanism according to claim 1,
wherein the polarization plane composing means includes an electro-optical modulator,
the pulsed laser beam emitted from the laser oscillator is selectively converted into the pulsed laser beam having the second polarization plane by the electro-optical modulator, to synthesize the pulsed laser beam having the first polarization plane and the pulsed laser beam having the second polarization plane,
the pulsed laser beam extracting means includes a polarization beam splitter, and
wherein the polarization beam splitter extracts the pulsed laser beam having the first polarization plane and the pulsed laser beam having the second polarization plane in forms of p-polarized light and s-polarized light.

### Claim 3 (depends on 1)

The laser applying mechanism according to claim 1, wherein the pulsed laser beam extracting means includes a cubic-type polarization beam splitter, and
wherein the polarization beam splitter extracts the pulsed laser beam having the first polarization plane and the pulsed laser beam having the second polarization plane in forms of p-polarized light and s-polarized light.

### Claim 4 (depends on 2)

The laser applying mechanism according to claim 2, further comprising a beam damper configured to receive the s-polarized light from the polarization beam splitter.