# US 11,027,275 B2 · Method for fabricating microfluidic structures

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- Number: US 11,027,275 B2
- Document ID: US11027275B2
- Status: Granted
- Kind: B2
- Application number: 16/748,812
- Filed: 2020-01-22
- Published: 2020-05-21
- Granted: 2021-06-08
- Earliest claimed: 2014-01-21
- Assignees: National Tsing Hua University
- Applicants: National Tsing Hua University
- Inventors: Chien-Chong Hong; Shih-Hong You; Wen Chung
- Web page: https://patentgrep.com/patent/US11027275B2

## CPC

- B01L 3/502707: {characterised by the manufacture of the container or its components}
- B32B 37/12: characterised by using adhesives
- B32B 37/18: involving the assembly of discrete sheets or panels only
- B32B 38/0004: {Cutting, tearing or severing, e.g. bursting; Cutter details (cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence)}
- B32B 38/10: Removing layers, or parts of layers, mechanically or chemically
- B81C 99/0095: {Aspects relating to the manufacture of substrate-free structures, not covered by groups B81C99/008 - B81C99/009}
- B01L 2200/12: Specific details about manufacturing devices
- B01L 2300/0816: Cards, e.g. flat sample carriers usually with flow in two horizontal directions
- B01L 2300/0887: Laminated structure
- B01L 2300/123: Flexible; Elastomeric
- B81B 2201/058: Microfluidics not provided for in B81B2201/051 - B81B2201/054
- Y10T 29/49895: Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
- Y10T 156/1051: by folding
- Y10T 156/1064: Partial cutting [e.g., grooving or incising]
- Y10T 156/1082: Partial cutting bonded sandwich [e.g., grooving or incising]
- B01L: CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method for fabricating microfluidic structures is provided. The method includes: a belt is provided and an adhesion layer is formed on at least one surface of the belt; the belt is cut for forming a first microfluidic channel thereon, wherein the first microfluidic channel has an accommodating space; a second microfluidic channel is provided, wherein a line-width of the second microfluidic channel is smaller than a line-width of the first microfluidic channel; the second microfluidic channel is disposed in the accommodating space of the first microfluidic channel; and a substrate is adhered to the belt via the adhesion layer.

## Claims

### Claim 1

A method for fabricating microfluidic structures, comprising:
providing a first belt and forming an adhesion layer on at least one surface of the first belt;
cutting the first belt for forming a first microfluidic channel, wherein the first microfluidic channel comprises a first depth;
providing a second belt and forming an adhesion layer on at least one surface of the second belt;
cutting the second belt for forming a second microfluidic channel, wherein the second microfluidic channel comprises a second depth;
adhering the first belt and the second belt via the adhesion layer of the first belt and the adhesion layer of the second belt; and
stacking the first belt and the second belt in order to stack the first depth and the second depth.

### Claim 2 (depends on 1)

The method of claim 1, wherein the first depth is different from the second depth.

### Claim 3 (depends on 1)

The method of claim 1, wherein the first depth or the second depth is ranged from 30 μm to 400 μm respectively.