Particles, connecting material and connection structure

Abstract

Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part, and can increase the connection strength are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 μm or more and 300 μm or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.

Dependencies are inferred from the claim text.