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AssigneeIntel Corporation
InventorsKyle Yazzie, Anna M. Prakash, Suriyakala Ramalingam, Liwei Wang, Robert Starkston, Arnab Choudhury, Sandeep S. Iyer, Amanuel M. Abebaw, Nick Labanok
Estimating the term…
Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.
An apparatus, comprising:
An imaging system, comprising:
A computing device, comprising:
Dependencies are inferred from the claim text.