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US 11,020,811 B2Granted
Solder removal from semiconductor devices
AssigneeMicron Technology, Inc.
InventorMark E. Tuttle
Life of this patent
Estimating the term…
Abstract
A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.
Claims20
A solder removal apparatus, comprising:
- a plurality of solder-interfacing protrusions including an elongated hollow pin extending from a body by a length, each of the plurality of solder-interfacing protrusions configured to remove a corresponding one of a plurality of solder features from a semiconductor device, each of the plurality of solder features having a height and an amount of solder material,
- wherein each of the solder-interfacing protrusions has a single opening at a distal end thereof opposite the body configured to remove the corresponding one of the plurality of solder features from a semiconductor device by vacuum suction.
A solder removal apparatus, comprising:
- a body;
- a plurality of solder-interfacing elongated hollow pins extending from the body by a length, each of the plurality of solder-interfacing elongated hollow pins having a single opening at a distal end thereof opposite the body that is configured to remove a corresponding one of a plurality of solder features from a semiconductor device by vacuum suction;
- a vacuum port;
- and
- one or more vacuum channels operably coupling the vacuum port to the plurality of solder-interfacing elongated hollow pins.
2 more elements
Dependencies are inferred from the claim text.