A computer program product having a computer readable medium including programmed instructions, wherein the instructions, when executed by a computer, cause the computer to control a semiconductor storage device including a plurality of memory cells each including a semiconductor storage element including a silicon carbide substrate and a silicon carbide film on a first surface of the silicon carbide substrate, a lower electrode on a second surface facing away from the first surface of the silicon carbide substrate, and an upper electrode on at least part of at least one third surface of the silicon carbide film, the third surface facing away from the first surface of the silicon carbide film in contact with the silicon carbide substrate, each memory cell including at least one basal plane dislocation formed at at least part of the semiconductor storage element,
- the semiconductor storage device including
- a plurality of word lines each being connected to memory cells arranged in a row direction of the plurality of memory cells arranged in a matrix as one group;
- a plurality of bit lines each being connected to memory cells arranged in a column direction of the plurality of memory cells arranged in a matrix as one group;
- a drive unit configured to selectively drive the plurality of word lines;
- a column module configured to selectively drive the plurality of bit lines;
- and
- a processor configured to control the drive unit and the column module,
- the computer program product causing the processor to control the drive unit and the column module to apply a first current to a first memory cell of the plurality of memory cells to develop a stacking fault from the basal plane dislocation in the first memory cell, when data is written to the first memory cell.