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US 11,018,038 B2Granted
Apparatus for sawing a semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsYong Ki Kim, Yo Se Eum
Life of this patent
Estimating the term…
Abstract
A semiconductor package sawing device is provided that includes a semiconductor package sawing unit, an automatic tool providing portion disposed adjacent to the semiconductor package sawing unit, and a semiconductor package alignment portion. The automatic tool providing portion includes a transfer unit for transferring a chuck unit to the semiconductor package sawing unit.
Claims17
A semiconductor package sawing device, comprising:
- a semiconductor package sawing unit;
- an automatic tool providing portion disposed adjacent to the semiconductor package sawing unit;
- and
- a semiconductor package alignment portion,
- wherein the automatic tool providing portion includes a transfer unit for transferring a chuck unit to the semiconductor package sawing unit,
- wherein the transfer unit includes a mounting member that adsorbs the chuck unit for a semiconductor package by suction force,
- wherein the mounting member includes a first separation prevention member for preventing the chuck unit from separation from the mounting member,
- wherein the first separation prevention member includes:
- a body having an internal space;
- a lifting portion disposed inside the body and having a piston shape;
- and
- a hook connected to the lifting portion and exposed to an exterior of the body.
9 more elements
A semiconductor package sawing device, comprising:
- a semiconductor package sawing unit;
- an automatic tool providing portion disposed adjacent to the semiconductor package sawing unit and including a chuck supply area;
- a fixing chuck disposed in the chuck supply area for securing a chuck;
- a semiconductor package alignment portion disposed adjacent to the semiconductor package sawing unit or the automatic tool providing portion;
- a transfer unit coupled to the automatic tool providing portion for transferring a chuck unit disposed on the fixing chuck;
- a first mounting member coupled to the transfer unit;
- a transferring auxiliary member detachably coupled to the first mounting member;
- and
- a chuck recognition portion disposed at a side surface of the first mounting member,
- wherein the semiconductor package sawing unit includes a pickup unit disposed on a guide member for guiding a transfer path of the chuck unit,
- wherein the pickup unit includes:
- a pickup unit body;
- and
- a second mounting member disposed in a lifting member of the pickup unit body,
- wherein the second mounting member includes a connector to which a vacuum line is connected,
- wherein both side surfaces of the second mounting member include a separation prevention member for preventing separation of the chuck unit,
- wherein the separation prevention member includes:
- a body having an internal space;
- a lifting portion disposed inside the body;
- and
- a hook connected to the lifting portion and exposed to an exterior of the body.
18 more elements
Dependencies are inferred from the claim text.