# US 11,017,973 B2 · Heat sink apparatus for microwave magnetron > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,017,973 B2 - Document ID: US11017973B2 - Status: Granted - Kind: B2 - Application number: 16/697,263 - Filed: 2019-11-27 - Published: 2020-06-04 - Granted: 2021-05-25 - Earliest claimed: 2018-11-30 - Assignees: Ton-Rong Tseng; Mastek Technologies - Applicants: Ton-Rong Tseng; Mastek Technologies, Inc. - Inventors: Ton-Rong Tseng - Web page: https://patentgrep.com/patent/US11017973B2 ## CPC - H01J 23/005: {Cooling methods or arrangements (H01J23/033 takes precedence)} - H01J 25/50: Magnetrons, i.e. tubes with a magnet system producing an H-field crossing the E-field (with travelling wave not moving completely around the electron space H01J25/42; functioning with plural reflection or with reversed cyclotron action H01J25/62, H01J25/64) - H05B 6/642: {Cooling of the microwave components and related air circulation systems (H05B6/6473 takes precedence)} - H05K 7/20: Modifications to facilitate cooling, ventilating, or heating - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A heat sink apparatus for a microwave magnetron includes a thermal conduction seat, a first heat-fin set, and at least one first heat pipe. One end of the first heat pipe protrudes into the thermal conduction seat, while another end of the first heat pipe protrudes into the first heat-fin set. An antenna of the microwave magnetron is to penetrate through the thermal conduction seat. ## Claims ### Claim 1 A heat sink apparatus for a microwave magnetron, comprising: a thermal conduction seat; a first heat-fin set; and at least one first heat pipe, having one end thereof to protrude into the thermal conduction seat and another end thereof to extend into the first heat-fin set; wherein the thermal conduction seat has a central hole for allowing n antenna of a microwave magnetron to penetrate therethrough. ### Claim 2 (depends on 1) The heat sink apparatus for a microwave magnetron of claim 1, further having a first heat-dissipation fan mounted to the first heat-fin set. ### Claim 3 (depends on 1) The heat sink apparatus for a microwave magnetron of claim 1, wherein the first heat-fin set further has a lateral shield, and the first heat pipe is one of a flat heat pipe and a plurality of heat pipes. ### Claim 4 (depends on 1) The heat sink apparatus for a microwave magnetron of claim 1, further having at least one second heat pipe and a second heat-fin set, one end of the second heat pipe penetrating into the thermal conduction seat, another end of the second heat pipe extending into the second heat-fin set. ### Claim 5 (depends on 4) The heat sink apparatus for a microwave magnetron of claim 4, further having a second heat-dissipation fan mounted to the second heat-fin set. ### Claim 6 (depends on 5) The heat sink apparatus for a microwave magnetron of claim 5, wherein the second heat-fin set further has a lateral shield, and the second heat pipe is one of a flat heat pipe and a plurality of heat pipes. ### Claim 7 (depends on 1) The heat sink apparatus for a microwave magnetron of claim 1, wherein the thermal conduction seat has a first block and a second block, the first block has a first half-moon cavity, and the second block has a second half-moon cavity; wherein, as the first block and the second block are paired together to form the thermal conduction seat, the first half-moon cavity and the second half-moon cavity are integrated to form the central hole for allowing the antenna to penetrate therethrough. ### Claim 8 (depends on 7) The heat sink apparatus for a microwave magnetron of claim 7, wherein one end of the first heat pipe penetrates through the first block, and another end of the first heat pipe penetrates through the first heat-fin set and protrudes into the second block. ### Claim 9 (depends on 8) The heat sink apparatus for a microwave magnetron of claim 8, wherein one end of the first heat pipe protrudes into the first heat-fin set, and another end of the first heat pipe protrudes into the first block; wherein one end of the second heat pipe protrudes into the second heat-fin set, and another end of the second heat pipe protrudes into the second block. ### Claim 10 (depends on 4) The heat sink apparatus for a microwave magnetron of claim 4, wherein the thermal conduction seat has a first block and a second block, the first block has a first half-moon cavity, and the second block has a second half-moon cavity; wherein, as the first block and the second block are paired together to form the thermal conduction seat, the first half-moon cavity and the second half-moon cavity are integrated to form the central hole for allowing the antenna to penetrate therethrough. ### Claim 11 (depends on 10) The heat sink apparatus for a microwave magnetron of claim 10, wherein one end of the first heat pipe penetrates through the first block, and another end of the first heat pipe penetrates through the first heat-fin set and protrudes into the second block. ### Claim 12 (depends on 11) The heat sink apparatus for a microwave magnetron of claim 11, wherein one end of the first heat pipe protrudes into the first heat-fin set, and another end of the first heat pipe protrudes into the first block; wherein one end of the second heat pipe protrudes into the second heat-fin set, and another end of the second heat pipe protrudes into the second block. ### Claim 13 (depends on 1) The heat sink apparatus for a microwave magnetron of claim 1, further having a lateral shield located under the first heat-fin set to cover the thermal conduction seat and the microwave magnetron.