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US 11,015,087 B2Granted
Polishing composition, method for producing polishing composition, polishing method, and method for producing semiconductor substrate
AssigneeFujimi Incorporated
InventorTzu-Chun Tseng
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Abstract
A polishing composition according to the present invention includes: silica; an anionic water-soluble polymer; at least one compound selected from the group consisting of a phosphonate group-containing compound, a phosphate group-containing compound, and an amino group-containing compound; and a dispersing medium.
Claims10
A polishing composition comprising:
- silica;
- an anionic water-soluble polymer;
- diethylenetriamine penta(methylenephosphonic acid) present at a concentration of 50 ppm or more and 500 ppm or less;
- and
- a dispersing medium,
- wherein a content of the anionic water-soluble polymer is 1600 ppm or more, a weight average molecular weight of the anionic water-soluble polymer is 1000 or more, and a pH of the polishing composition is 2.5 or less.
3 more elements
Dependencies are inferred from the claim text.