Methods and apparatus for multi-cathode substrate processing
AssigneeApplied Materials, Inc.
InventorsHanbing Wu, Anantha K. Subramani, Ashish Goel, Xiaodong Wang, Wei W. Wang, Rongjun Wang, Chi Hong Ching
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Abstract
Methods and apparatus for processing substrates with a multi-cathode chamber. The multi-cathode chamber includes a shield with a plurality of holes and a plurality of shunts. The shield is rotatable to orient the holes and shunts with a plurality of cathodes located above the shield. The shunts interact with magnets from the cathodes to prevent interference during processing. The shield can be raised and lowered to adjust gapping between a target of a cathode and a hole to provide a dark space during processing.
Claims20
A process chamber, comprising:
- a chamber body defining an interior volume;
- a substrate support to support a substrate within the interior volume;
- a plurality of cathodes coupled to the chamber body and having a plurality of targets;
- and
- a shield rotatably coupled to an upper portion of the chamber body and having at least one hole to expose at least one of the plurality of targets to be sputtered in a process and at least one magnetic field shunt disposed in a topside of the shield to accommodate and shield at least another one of the plurality of targets not to be sputtered in the process, wherein the shield is configured to rotate about and linearly move along a central axis of the process chamber and wherein the at least one magnetic field shunt is configured to decrease magnetic fields of a magnet above a target by engaging a top surface of the at least one magnetic field shunt with one of the plurality of targets when the shield is raised to an uppermost position in the interior volume.
A process chamber, comprising:
- a chamber body defining an interior volume;
- a chamber body adapter coupled to an upper portion of the chamber body, wherein the chamber body adapter is grounded;
- a substrate support to support a substrate within the interior volume;
- a plurality of cathodes coupled the chamber body adapter and having a plurality of targets;
- a shield rotatably coupled to the chamber body adapter and having at least one hole to expose at least one of the plurality of targets being sputtered in a process and at least one magnetic field shunt to accommodate and shield at least another one of the plurality of targets not being sputtered in the process, wherein the shield is configured to rotate about and linearly move along a central axis of the process chamber;
- and
- at least one grounding trace on a lower surface of the chamber body adapter at least partially enclosing at least one of the plurality of targets, the at least one grounding trace has a plurality of contact bodies attached to the at least one grounding trace, each of the plurality of contact bodies has multiple compliant contact surfaces configured to make contact with and ground the shield to the chamber body adapter,
- wherein the plurality of targets includes at least one dielectric target and at least one metallic target.
An apparatus for processing substrates in a process chamber, comprising:
- a shield configurable to be rotatably coupled to a chamber body of the process chamber, the shield having at least one hole to expose at least one of a plurality of targets to be sputtered and at least one magnetic field shunt to shield at least one of a plurality of targets not to be sputtered, wherein the shield is configurable to rotate about and linearly move along a central axis of the process chamber,
- wherein the shield has a mounting arm with at least one radial extension embedded into a top of the shield, wherein a top surface of the mounting arm and a top surface of the shield are co-planar, wherein the at least one magnetic field shunt is located in a pocket of the at least one extension of the mounting arm and the at least one hole is located exterior of the at least one extension of the mounting arm in the top of the shield.
Dependencies are inferred from the claim text.