Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsMasahiko Shigaki, Kentaro Takano
Life of this patent
Estimating the term…
Abstract
Provided is a resin composition comprising a polymaleimide compound (A) represented by the following general formula (1), a modified polyphenylene ether (B) having a terminal modified with a substituent containing a carbon-carbon unsaturated double bond, and a filler (C): wherein a plurality of R each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group; and n is an average value and represents 1<n≤5.
Claims12
A resin composition comprising a polymaleimide compound (A) represented by the following formula (1), a modified polyphenylene ether (B) having a terminal modified with a substituent containing a carbon-carbon unsaturated double bond, and a filler (C),
- wherein a plurality of R each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group;
- and n is an average value and represents 1<n≤5;
- and
- wherein the resin composition is devoid of organic peroxides.
The resin composition according to 1, wherein the content of the polymaleimide compound (A) represented by the formula (1) is 1 to 90 parts by mass based on 100 parts by mass of resin solid content in the resin composition.
Dependencies are inferred from the claim text.