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US 11,007,558 B2Granted
Diamond die
AssigneesSumitomo Electric Hardmetal Corp., Sumitomo Electric Industries, Ltd., A.L.M.T. Corp.
InventorsMakoto Yukawa, Bunya Suemitsu, Takuya Kinoshita, Shigetoshi Sumimoto, Yutaka Kobayashi, Akihiko Ueda, Natsuo Tatsumi, Yoshiki Nishibayashi, Hitoshi Sumiya
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Abstract
A diamond die includes a diamond provided with a hole for drawing a wire material, the diamond being a CVD single-crystal diamond, an axis of the hole being inclined relative to a normal direction of a crystal plane of the diamond.
Claims11
A diamond die comprising a diamond provided with a hole for drawing a wire material,
- the diamond being a CVD single-crystal diamond,
- an axis of the hole being inclined relative to a normal direction of a crystal plane of the diamond,
- the diamond having an upper and lower surface and being provided with the hole extending from the upper surface to the lower surface and being formed perpendicular to the upper surface and lower surface,
- the upper and lower surfaces of the diamond being inclined relative to a (110) plane by 1° to 15°.
1 more element
Dependencies are inferred from the claim text.